1136 ITT - CCM Catalog 11/20/00 12:28 PM Page 29
CCM03 MK II
A new range of CCM03 connectors
Construction
have been developed to interface with
SIM/SAM cards as defined by GSM11-
11 and ENV1375-1. The connectors are
available with either hinged covers or
fixed covers and have been designed to
minimize the amount of space needed
for PCB mounting.
Contacts
Plating
Copper alloy
Contact area : Gold alloy inlay
Terminals : Tin lead (2µ min)
High temp. thermoplastic UL 94V-0 rated
Stainless steel
Moldings
Spring
Mechanical data
Features
Number of Contacts
6 or 8
Mechanical life, hinged cover
Mechanical life, fixed cover
Durability of inlay, hinged cover
Durability of inlay, fixed cover
Card insertion force
10,000 cycles min
50,000 cycles
10,000 cycles min (see note 1)
5,000 cycles
Hinged cover: 1 N max
Fixed cover: 3 N max
Hinged Cover
• Available with 6 or 8 contacts, with or
without PCB locating pegs.
• Available with card presence switch.
• The cover springs open when
unlocked while the card is in place.
Card extraction force
Hinged cover: 1 N max
Fixed cover: 0.80 N min / 3 N max
Contact force
Slide locking force
Vibration
0.25 N min / 0.50 N max
2 N min / 6 N max
• The molding is polarized so that the
cover can only be closed if the card is
correctly inserted.
Frequency 10 to 500 Hz. Acceleration 50m/s2
Duration 6 hours - amplitude 0.35 mm
Max electrical discontinuity 1µs
• The cover can be replaced without
removing the connector from the PCB
Shock
Peak value 500 m/s2 – Duration 11 ms
3 shocks in each direction of each axis
Max electrical discontinuity 1 µs
• Inspection slots allow an electrical test
to be made without opening the cover.
Electrical data
• The overall height of the connector is
only 2.5 mm. The amount of space
needed to mount the connector is just
29.65 mm x 17.2 mm
Insulation resistance
Contact resistance max
Switching current
Dielectric strength
1,000 MΩ min
100 mΩ max
10 µA min / 1 A max
750 Vrms min
Fixed Cover
Environmental data
• Available with 6 or 8 contacts.
Operating temperature
Soldering temperature
-40°C to +85°C
Temperature/time profile acc. to CECC00802
para. 6.1, Fig. 3 with peak temperature 250°C
IEC 512 test number 11c (10 days)
IEC 512 test number 11f (96 hours)
• The overall height of the connector is
2.85 mm max. Only 25.5 mm x 17.2
mm of board space is required to
mount the connector.
Damp heat
Salt mist
General
Note 1: Inlay (precious metal) rating is based on a very abrasive card being used and is
intended to represent worst case.
• With tape and reel packaging as
standard, the connectors are designed
to be automatically pick-and-placed.
• The high temperature thermoplastic
moldings are suited for infrared and
convection soldering processes.
• By using an inlay finish in the contact
area the life of the precious metal is
extended by over 10 times that of
standard gold plating.
• Robustly formed printed circuit tails
allow a co-planarity of ±0.05 mm to
be maintained.
Dimensions are shown in mm
Dimensions subject to change
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