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CC106D004JAS

更新时间: 2024-11-02 20:59:03
品牌 Logo 应用领域
威世 - VISHAY 电容器
页数 文件大小 规格书
6页 284K
描述
CAPACITOR, TANTALUM, SOLID, POLARIZED, 4V, 10uF, SURFACE MOUNT, 1510, CHIP

CC106D004JAS 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:, 1510Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8532.21.00.50
风险等级:5.75电容:10 µF
电容器类型:TANTALUM CAPACITOR介电材料:TANTALUM (DRY/SOLID)
JESD-609代码:e0漏电流:0.0005 mA
安装特点:SURFACE MOUNT负容差:5%
端子数量:2最高工作温度:85 °C
最低工作温度:-55 °C封装形状:RECTANGULAR PACKAGE
包装方法:TR极性:POLARIZED
正容差:5%额定(直流)电压(URdc):4 V
尺寸代码:1510表面贴装:YES
Delta切线:0.08端子面层:Tin/Lead (Sn/Pb)
端子形状:WRAPAROUNDBase Number Matches:1

CC106D004JAS 数据手册

 浏览型号CC106D004JAS的Datasheet PDF文件第2页浏览型号CC106D004JAS的Datasheet PDF文件第3页浏览型号CC106D004JAS的Datasheet PDF文件第4页浏览型号CC106D004JAS的Datasheet PDF文件第5页浏览型号CC106D004JAS的Datasheet PDF文件第6页 
CC/EC  
Vishay Sprague  
Solid Tantalum Chip Capacitors  
Conformal Coated  
FEATURES  
Eight standard case codes, "pad compatible"  
with MIL-PRF-55365/4 (CWR06).  
High volumetric efficiency  
(Up to 200,000 CV per cubic inch).  
RoHS*  
COMPLIANT  
Low profile, conformal-coated construction.  
100 % low impedance power burn-in at + 85 °C.  
Low ESR in high frequency applications.  
Packaging in 50 unit 'Blister-Pack' trays or 8 mm or 12 mm  
tape and reel.  
Gold plated or solder dipped terminations.  
Type CC/EC capacitors are commercial equivalents of  
49BC/EC.  
APPLICATIONS  
Medical  
Aerospace  
Military Hybrids  
DIMENSIONS in inches [millimeters]  
Negative Termination  
Positive Termination  
W
Top View  
(See Note 1)  
L
0.005  
[0.127]  
Typ.  
H
B
S
B
0.015 [0.381]  
Max. Weld Stub  
Side View  
CASE  
CODE  
LENGTH  
L
WIDTH  
W
HEIGHT  
SPACING TYPICAL  
S
PAD WIDTH  
B
TYPICAL WEIGHT  
(Grams)  
H
0.040  
[1.02]  
0.100 0.015  
[2.54 0.381]  
0.050 0.015  
[1.27 0.381]  
0.050 0.015  
[1.27 0.381]  
0.030 0.005  
[0.76 0.127]  
A
B
C
D
E
F
0.02  
0.03  
0.04  
0.07  
0.09  
0.21  
0.33  
0.50  
0.150 0.015  
[3.81 0.381]  
0.050 0.015  
[1.27 0.381]  
0.050 0.015  
[1.27 0.381]  
0.090  
[2.29]  
0.030 0.005  
[0.76 0.127]  
0.200 0.015  
[5.08 0.381]  
0.050 0.015  
[1.27 0.381]  
0.050 0.015  
[1.27 0.381]  
0.140  
[3.55]  
0.030 0.005  
[0.76 0.127]  
0.150 0.015  
[3.81 0.381]  
0.100 0.015  
[2.54 0.381]  
0.050 0.015  
[1.27 0.381]  
0.090  
[2.29]  
0.030 0.005  
[0.76 0.127]  
0.200 0.015  
[5.08 0.381]  
0.100 0.015  
[2.54 0.381]  
0.050 0.015  
[1.27 0.381]  
0.140  
[3.55]  
0.030 0.005  
[0.76 0.127]  
0.220 0.015  
[5.59 0.381]  
0.135 0.015  
[3.43 0.381]  
0.070 0.015  
[1.78 0.381]  
0.160  
[4.06]  
0.030 0.005  
[0.76 0.127]  
0.265 0.015  
[6.73 0.381]  
0.110 0.015  
[2.79 0.381]  
0.110 0.015  
[2.79 0.381]  
0.165  
[4.19]  
0.050 0.005  
[1.27 0.127]  
G
H
0.285 0.015  
[7.25 0.381]  
0.150 0.015  
[3.81 0.381]  
0.110 0.015  
[2.79 0.381]  
0.185  
[4.70]  
0.050 0.005  
[1.27 0.127]  
Notes:  
1. For polarity identification, when chip is in mounting position, bare metal clip and weld stub are positive. Top surface of the negative terminal is blue.  
2. Anode Riser (weld stub) may extend case size length dimension by 0.015" [0.381] maximum.  
3. Dimensions given are for gold plated terminations. For solder dipped terminations, add 0.015" [0.381] to dimension tolerances.  
4. Spacing dimension is average distance between chip mounting terminations and therefore maximum distance between mounting pads on  
substrate..  
* Pb containing terminations that are not RoHS compliant, exemptions may apply.  
www.vishay.com  
1
For technical questions, contact: tantalum@vishay.com  
Document Number: 43017  
Revision: 17-Aug-05  

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