CC/EC
Vishay Sprague
Solid Tantalum Chip Capacitors
Conformal Coated
FEATURES
• Eight standard case codes, "pad compatible"
with MIL-PRF-55365/4 (CWR06).
• High volumetric efficiency
(Up to 200,000 CV per cubic inch).
RoHS*
COMPLIANT
• Low profile, conformal-coated construction.
• 100 % low impedance power burn-in at + 85 °C.
• Low ESR in high frequency applications.
• Packaging in 50 unit 'Blister-Pack' trays or 8 mm or 12 mm
tape and reel.
• Gold plated or solder dipped terminations.
• Type CC/EC capacitors are commercial equivalents of
49BC/EC.
APPLICATIONS
• Medical
• Aerospace
• Military Hybrids
DIMENSIONS in inches [millimeters]
Negative Termination
Positive Termination
W
Top View
(See Note 1)
L
0.005
[0.127]
Typ.
H
B
S
B
0.015 [0.381]
Max. Weld Stub
Side View
CASE
CODE
LENGTH
L
WIDTH
W
HEIGHT
SPACING TYPICAL
S
PAD WIDTH
B
TYPICAL WEIGHT
(Grams)
H
0.040
[1.02]
0.100 0.015
[2.54 0.381]
0.050 0.015
[1.27 0.381]
0.050 0.015
[1.27 0.381]
0.030 0.005
[0.76 0.127]
A
B
C
D
E
F
0.02
0.03
0.04
0.07
0.09
0.21
0.33
0.50
0.150 0.015
[3.81 0.381]
0.050 0.015
[1.27 0.381]
0.050 0.015
[1.27 0.381]
0.090
[2.29]
0.030 0.005
[0.76 0.127]
0.200 0.015
[5.08 0.381]
0.050 0.015
[1.27 0.381]
0.050 0.015
[1.27 0.381]
0.140
[3.55]
0.030 0.005
[0.76 0.127]
0.150 0.015
[3.81 0.381]
0.100 0.015
[2.54 0.381]
0.050 0.015
[1.27 0.381]
0.090
[2.29]
0.030 0.005
[0.76 0.127]
0.200 0.015
[5.08 0.381]
0.100 0.015
[2.54 0.381]
0.050 0.015
[1.27 0.381]
0.140
[3.55]
0.030 0.005
[0.76 0.127]
0.220 0.015
[5.59 0.381]
0.135 0.015
[3.43 0.381]
0.070 0.015
[1.78 0.381]
0.160
[4.06]
0.030 0.005
[0.76 0.127]
0.265 0.015
[6.73 0.381]
0.110 0.015
[2.79 0.381]
0.110 0.015
[2.79 0.381]
0.165
[4.19]
0.050 0.005
[1.27 0.127]
G
H
0.285 0.015
[7.25 0.381]
0.150 0.015
[3.81 0.381]
0.110 0.015
[2.79 0.381]
0.185
[4.70]
0.050 0.005
[1.27 0.127]
Notes:
1. For polarity identification, when chip is in mounting position, bare metal clip and weld stub are positive. Top surface of the negative terminal is blue.
2. Anode Riser (weld stub) may extend case size length dimension by 0.015" [0.381] maximum.
3. Dimensions given are for gold plated terminations. For solder dipped terminations, add 0.015" [0.381] to dimension tolerances.
4. Spacing dimension is average distance between chip mounting terminations and therefore maximum distance between mounting pads on
substrate..
* Pb containing terminations that are not RoHS compliant, exemptions may apply.
www.vishay.com
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For technical questions, contact: tantalum@vishay.com
Document Number: 43017
Revision: 17-Aug-05