是否无铅: | 不含铅 | 生命周期: | Active |
包装说明: | MS-012, SOIC-8 | 针数: | 8 |
Reach Compliance Code: | compliant | Factory Lead Time: | 10 weeks |
风险等级: | 5.75 | 备用内存宽度: | 8 |
最大时钟频率 (fCLK): | 2 MHz | JESD-30 代码: | R-PDSO-G8 |
JESD-609代码: | e4 | 长度: | 4.9 mm |
内存密度: | 8192 bit | 内存集成电路类型: | EEPROM |
内存宽度: | 16 | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 8 |
字数: | 512 words | 字数代码: | 512 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | 组织: | 512X16 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOP |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
并行/串行: | SERIAL | 峰值回流温度(摄氏度): | NOT SPECIFIED |
座面最大高度: | 1.75 mm | 串行总线类型: | MICROWIRE |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 2.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | AUTOMOTIVE |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 3.9 mm |
Base Number Matches: | 1 |
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