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CAVC2T45TDCURQ1

更新时间： 2024-11-24 12:50:39
品牌 Logo 应用领域
德州仪器 - TI 总线驱动器总线收发器逻辑集成电路光电二极管输出元件
页数 文件大小 规格书
21页 665K
描述
DUAL-BIT DUAL-SUPPLY BUS TRANSCEIVER WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS

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CAVC2T45TDCURQ1 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：SOIC
包装说明：VSSOP, TSSOP8,.12,20针数：8
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01Factory Lead Time：1 week
风险等级：1.73控制类型：COMMON CONTROL
计数方向：BIDIRECTIONAL系列：AVC
JESD-30 代码：R-PDSO-G8JESD-609代码：e4
长度：2.3 mm逻辑集成电路类型：BUS TRANSCEIVER
最大I（ol）：0.012 A湿度敏感等级：1
位数：2功能数量：1
端口数量：2端子数量：8
最高工作温度：125 °C最低工作温度：-40 °C
输出特性：3-STATE输出极性：TRUE
封装主体材料：PLASTIC/EPOXY封装代码：VSSOP
封装等效代码：TSSOP8,.12,20封装形状：RECTANGULAR
封装形式：SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH包装方法：TR
峰值回流温度（摄氏度）：260电源：1.5/3.3 V
最大电源电流（ICC）：0.02 mAProp。Delay @ Nom-Sup：5.6 ns
传播延迟（tpd）：5.6 ns认证状态：Not Qualified
筛选级别：AEC-Q100座面最大高度：0.9 mm
子类别：Bus Driver/Transceivers最大供电电压 (Vsup)：3.6 V
最小供电电压 (Vsup)：1.2 V标称供电电压 (Vsup)：1.5 V
表面贴装：YES技术：CMOS
温度等级：AUTOMOTIVE端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：GULL WING端子节距：0.5 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
翻译：1.5/3.3V &1.5/3.3V宽度：2 mm
Base Number Matches：1

CAVC2T45TDCURQ1 数据手册

 浏览型号CAVC2T45TDCURQ1的Datasheet PDF文件第2页浏览型号CAVC2T45TDCURQ1的Datasheet PDF文件第3页浏览型号CAVC2T45TDCURQ1的Datasheet PDF文件第4页浏览型号CAVC2T45TDCURQ1的Datasheet PDF文件第5页浏览型号CAVC2T45TDCURQ1的Datasheet PDF文件第6页浏览型号CAVC2T45TDCURQ1的Datasheet PDF文件第7页 
SN74AVC2T45-Q1  
www.ti.com  
SCES813 –JUNE 2010  
DUAL-BIT DUAL-SUPPLY BUS TRANSCEIVER  
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS  
Check for Samples: SN74AVC2T45-Q1  
1
FEATURES  
•
•
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
Qualified for Automotive Applications  
ESD Protection Exceeds JESD 22  
•
Control Inputs VIH/VIL Levels Are Referenced to  
VCCA Voltage  
–
–
–
8000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
•
Fully Configurable Dual-Rail Design Allows  
Each Port to Operate Over the Full 1.2-V to  
3.6-V Power-Supply Range  
1000-V Charged-Device Model (C101)  
DCU PACKAGE  
(TOP VIEW)  
•
•
I/Os Are 4.6-V Tolerant  
Ioff Supports Partial-Power-Down Mode  
Operation  
V
V
CCB  
1
2
3
4
8
7
6
5
CCA  
•
Max Data Rates  
A1  
B1  
A2  
B2  
–
–
–
–
–
500 Mbps (1.8-V to 3.3-V Translation)  
320 Mbps (<1.8-V to 3.3-V Translation)  
320 Mbps (Translate to 2.5 V or 1.8 V)  
280 Mbps (Translate to 1.5 V)  
GND  
DIR  
240 Mbps (Translate to 1.2 V)  
DESCRIPTION  
This dual-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is  
designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track  
VCCB. VCCB accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectional  
translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.  
The SN74AVC2T45 is designed for asynchronous communication between two data buses. The logic levels of  
the direction-control (DIR) input activate either the B-port outputs or the A-port outputs. The device transmits data  
from the A bus to the B bus when the B-port outputs are activated and from the B bus to the A bus when the  
A-port outputs are activated. The input circuitry on both A and B ports always is active and must have a logic  
HIGH or LOW level applied to prevent excess ICC and ICCZ  
.
The SN74AVC2T45 is designed so that the DIR input is powered by VCCA  
.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
The VCC isolation feature ensures that if either VCC input is at GND, both ports are in the high-impedance state.  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
SBUI  
–40°C to 105°C  
VSSOP – DCU  
Reel of 3000  
CAVC2T45TDCURQ1  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2010, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1234567...21

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