是否无铅: | 不含铅 | 生命周期: | Active |
零件包装代码: | TSOT | 包装说明: | HALOGEN FREE AND ROHS COMPLIANT, MO-193, TSOT-23-5 |
针数: | 5 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.51 |
风险等级: | 1.04 | 最大时钟频率 (fCLK): | 0.4 MHz |
JESD-30 代码: | R-PDSO-G5 | JESD-609代码: | e4 |
长度: | 2.9 mm | 内存密度: | 16384 bit |
内存集成电路类型: | EEPROM | 内存宽度: | 8 |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 5 | 字数: | 2048 words |
字数代码: | 2000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 2KX8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VSSOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | 并行/串行: | SERIAL |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 1 mm | 串行总线类型: | I2C |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | GULL WING |
端子节距: | 0.95 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 2.8 mm |
最长写入周期时间 (tWC): | 5 ms | Base Number Matches: | 1 |
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