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CAT16-103J2 PDF预览

CAT16-103J2

更新时间: 2024-10-28 04:51:59
品牌 Logo 应用领域
伯恩斯 - BOURNS /
页数 文件大小 规格书
4页 316K
描述
Chip Resistor Arrays

CAT16-103J2 数据手册

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Chip Resistor Arrays - Application Note  
Component Placement  
a. Reduce the mechanical stress to a minimum during and a%ter placing o% the unit in order not to damage the terminals and  
protective coating.  
b. Misplacement o% components may cause solder bridges.  
Soldering  
a. Re%low soldering: Recommendation is shown in the %ollowing chart.  
b. Wave soldering: Recommendation according to IEꢂ standards.  
c. Hand soldering: Don’t touch the protective coating o% the part. Solder within 3 seconds when the temperature is over (80 ºꢂ.  
Soldering  
Preheating  
Gradual Cooling  
250  
200  
150  
100  
50  
0
10-30 sec.  
60 sec. min.  
120 sec. min.  
Cleaning  
ꢃ recommended cleaning method is shown in the %ollowing table.  
Cleaning Condition  
Solvents  
Dipping  
Ultrasonic Wave Washing  
± minute maximum  
Power: (0 W/L  
Isopropyl alcohol  
5 minutes maximum  
Frequency: ±0 to ±00 kHz  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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RES ARRAY 2 RES 100K OHM 0606