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C9732DK-11

更新时间： 2024-02-05 02:26:49
品牌 Logo 应用领域
HAMAMATSU 光电二极管光电二极管
页数 文件大小 规格书
8页 486K
描述
For soft X-ray imaging, cassette type with USB 2.0 interface Large photodiode area: 120 × 120 mm

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中文翻译

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C9732DK-11 技术参数

是否Rohs认证： 符合生命周期：Active
Reach Compliance Code：unknown风险等级：5.76
阵列类型：FRAME主体宽度：193 mm
主体高度：14.5 mm主体长度或直径：266 mm
动态范围：74.15 dB帧速率：1 fps
水平像素：2400安装特点：BOARD MOUNT
最高工作温度：40 °C最低工作温度：
输出接口类型：USB INTERFACE输出类型：DIGITAL OUTPUT
封装形状/形式：RECTANGULAR像素大小：50X50 µm
传感器/换能器类型：IMAGE SENSOR,CMOS最大供电电压：5.1 V
最小供电电压：4.9 V表面贴装：NO
端接类型：CABLE垂直像素：2400
Base Number Matches：1

C9732DK-11 数据手册

 浏览型号C9732DK-11的Datasheet PDF文件第2页浏览型号C9732DK-11的Datasheet PDF文件第3页浏览型号C9732DK-11的Datasheet PDF文件第4页浏览型号C9732DK-11的Datasheet PDF文件第5页浏览型号C9732DK-11的Datasheet PDF文件第6页浏览型号C9732DK-11的Datasheet PDF文件第7页 
Flat panel sensor  
C9732DK-11  
For soft X-ray imaging, cassette type with USB 2.0 interface  
Large photodiode area: 120 × 120 mm  
The C9732DK-11 is two-dimensional CMOS image sensor module designed for X-ray imaging which requires high resolution,  
large area and wide dynamic range. A target material of X-ray source and X-ray energy adequate for the sensor is Mo and 17  
keV. The device shape is thin cassette which incorporate on-chip high-resolution scintillator and a control board. An on-board  
USB 2.0 interface can realize fast data transfer with the C9732DK-11.  
Features  
Applications  
2400 × 2400 pixels (50 μm pitch)  
High resolution  
X-ray imaging (optimized to 17 keV)  
14-bit digital output (USB 2.0 interface)  
High-speed imaging: 1 frame/s  
No dead area (insensitive area) due to seamless structure  
Compatible with HAMAMATSU API (DCAM-API)  
Structure  
The C9732DK-11 is comprised of a sensor board and a control board. Mounted on the sensor board is a CMOS image sensor chip made up of a  
two-dimensional photodiode array, row-scanning vertical shift register, and 8 charge amplifier arrays. Each charge amplifier array has a horizontal  
shift register and consists of 300 ch charge amplifiers with CDS circuit.  
CsI scintillator is directly deposited on the two-dimensional photodiode array. X-rays incident on the scintillator are converted to fluorescence,  
which then enters the two-dimensional photodiode array where electric charge is accumulated in each pixel according to the light intensity. The  
accumulated charge on each row is sequentially selected by the row-scanning vertical shift register, transferred to the amplifiers through the data  
line, and converted to a voltage signal. Then an analog signal is sent out from each amplifier array by scanning the horizontal shift register.  
The control board converts the analog signal into a 14-bit digital signal, which is then output to a PC through the USB 2.0 interface.  
Sensor board  
Pixel number  
1
2
2399 2400  
2401  
4799 4800  
External power supply  
A.vdd, D.vdd (not attached)  
Photodiode  
array  
with directly  
deposited CsI  
scintillator  
Oscillator  
5759999 5760000  
Timing  
pulse  
generator  
TrgIn  
Charge amp array  
No. 1  
(with horizontal shift  
register, 300 ch)  
Charge amp array  
No. 8  
(with horizontal shift  
register, 300 ch)  
TrgOut  
Bias  
generator  
Buffer  
amp  
Processing  
A/D  
A/D  
FIFO  
FIFO  
amp  
Video data  
Flat panel control  
(USB 2.0 interface)  
USB IC  
Buffer  
amp  
Processing  
amp  
Control board  
Note: Signals are read out in order of pixel number.  
KACCC031  
KACCC0310EC  
1
www.hamamatsu.com  
12345678

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