Datasheet > C3225X7R1H225M200AB_17

C3225X7R1H225M200AB_17

更新时间： 2024-11-05 01:22:43

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	235K
描述
Multilayer Ceramic Chip Capacitors

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C3225X7R1H225M200AB_17 数据手册

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Creation Date : June 02, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C3225X7R1H225K200AB

TDK item description C3225X7R1H225KT****

Commercial Grade

Applications

Please refer to Part No. CGA6M3X7R1H225K200AB for Automotive use.

General General (Up to 50V)

C3225 [EIA 1210]

Production (Not Recommended for New Design)

Feature

Series

Status

Size

3.20mm ±0.40mm

Length(L)

Width(W)

2.50mm ±0.30mm

2.00mm ±0.20mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

2.00mm to 2.40mm

1.00mm to 1.20mm

1.90mm to 2.50mm

Electrical Characteristics

Capacitance

2.2μF ±10%

50VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X7R(±15%)

227MΩ

Other

Soldering Method

AEC-Q200

Reﬂow

Packing

Blister (Plastic)Taping [180mm Reel]

1000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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