Datasheet > C3225X7R1H335M250AB_17

C3225X7R1H335M250AB_17

更新时间： 2024-11-05 01:22:43

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	239K
描述
Multilayer Ceramic Chip Capacitors

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C3225X7R1H335M250AB_17 数据手册

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Creation Date : June 29, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

CGA4J3X7R1C225K125AB

TDK item description CGA4J3X7R1C225KT****

Applications

Feature

Automotive Grade

General General (Up to 50V)

AEC-Q200 AEC-Q200

Series

Status

CGA4(2012) [EIA 0805]

Production

Size

2.00mm ±0.20mm

Length(L)

Width(W)

1.25mm ±0.20mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

0.50mm Min.

1.00mm to 1.30mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

1.00mm to 1.20mm(Flow Soldering)

0.70mm to 0.90mm(Reﬂow Soldering)

0.80mm to 1.10mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

2.2μF ±10%

16VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X7R(±15%)

7.5%

45MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Yes

Packing

Blister (Plastic)Taping [180mm Reel]

2000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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