Datasheet > C3225C0G3A182J200AC

C3225C0G3A182J200AC

更新时间： 2024-11-24 00:59:07

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	103K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : January 17, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C3225C0G3A122J200AC

TDK item description C3225C0G3A122JT****

Commercial Grade

Applications

Please refer to Part No. CGA6M1C0G3A122J200AC for Automotive use.

Feature

Series

Status

High High Voltage (1000V and over)

C3225 [EIA 1210]

Production (Not Recommended for New Design)

Size

Length(L)

3.20mm ±0.40mm

Width(W)

2.50mm ±0.30mm

2.00mm ±0.20mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

Recommended Slit Pattern (SD)

2.00mm to 2.40mm

1.00mm to 1.20mm

1.90mm to 2.50mm

Electrical Characteristics

Capacitance

1.2nF ±5%

1kVDC

Rated Voltage

Temperature Characteristic

Q (Min.)

C0G(0±30ppm/°C)

1000

Insulation Resistance (Min.)

10000MΩ

Other

Soldering Method

AEC-Q200

Reﬂow

Packing

Blister (Plastic)Taping [180mm Reel]

1000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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