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C3225C0G3A562J200AC PDF预览

C3225C0G3A562J200AC

更新时间: 2024-11-11 00:59:07
品牌 Logo 应用领域
东电化 - TDK /
页数 文件大小 规格书
3页 103K
描述
Multilayer Ceramic Chip Capacitors

C3225C0G3A562J200AC 数据手册

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Creation Date : January 17, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
C3225C0G3A122J200AC  
TDK item description C3225C0G3A122JT****  
Commercial Grade  
Applications  
Please refer to Part No. CGA6M1C0G3A122J200AC for Automotive use.  
Feature  
Series  
Status  
High High Voltage (1000V and over)  
C3225 [EIA 1210]  
Production (Not Recommended for New Design)  
Size  
Length(L)  
3.20mm ±0.40mm  
Width(W)  
2.50mm ±0.30mm  
2.00mm ±0.20mm  
0.20mm Min.  
Thickness(T)  
Terminal Width(B)  
Terminal Spacing(G)  
Recommended Land Pattern (PA)  
Recommended Land Pattern (PB)  
Recommended Land Pattern (PC)  
Recommended Slit Pattern (SD)  
2.00mm to 2.40mm  
1.00mm to 1.20mm  
1.90mm to 2.50mm  
Electrical Characteristics  
Capacitance  
1.2nF ±5%  
1kVDC  
Rated Voltage  
Temperature Characteristic  
Q (Min.)  
C0G(0±30ppm/°C)  
1000  
Insulation Resistance (Min.)  
10000MΩ  
Other  
Soldering Method  
AEC-Q200  
Reflow  
No  
Packing  
Blister (Plastic)Taping [180mm Reel]  
1000pcs  
Package Quantity  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  

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