Soft Termination C Series
Case
Length (mm)
Width (mm)
MaxThickness (mm)
C2012 (0805)
C3216 (1206)
C3225 (1210)
C4532 (1812)
C5750 (2220)
2.00 ± 0.20
3.20 ± 0.20
3.20 ± 0.20
4.50 ± 0.40
5.70 ± 0.40
1.25 ± 0.20
1.60 ± 0.20
2.50 ± 0.30
3.20 ± 0.40
5.70 ± 0.40
1.45
1.80
2.80
2.50
3.10
L
W
T
C
2012 X8R 1H 683 K T XXXS
Series Name
Dimensions L x W (mm)
Temperature Characteristic
Rated Voltage (DC)
Nominal Capacitance (pF)
• Improved bending resistance (Board Flex Resistance)
• Improved temperature cycle performance
• Soft termination is available for most TDK MLCC product lines (up to C3225
case size) and including the 2-in-1 Cap Array line
• RoHS, WEE, and REACH compliant
Capacitance Tolerance
Packaging Style
• Automotive powertrain control unit / sensor module
• Switching power supply
Internal Codes
• Telecom base station
• Electronic circuits mounted on alumina substrate
• SMT application which requires bending robustness
• Pb-free solder application in which solder joint reliability is problematic
C2012 (0805)
C3216 (1206)
C3225 (1210)
C4532 (1812)
C5750 (2220)
Capacitance
450V
(2W)
250V
(2E)
100V
(2A)
50V
(1H)
35V
(1V)
16V
(1C)
630V
450V
250V
100V
(2A)
50V
35V
(1V)
25V
(1E)
630V
(2J)
450V
(2W)
250V
(2E)
100V
50V
(1H)
630V
(2J)
450V
(2W)
250V
630V
(2J)
450V
(2W)
250V
(2E)
100V
(2A)
(2J)
X7R
X7R
X7T
(2W)
(2E)
(1H)
(2A)
(2E)
10 nF
22 nF
47 nF
100 nF
220nF
470nF
1,0 uF
2,2 uF
4,7 uF
10 uF
X7T
X7T
X7T
X7R
X7R
X7T
X7T
X7R
X7T
X7T
X7R
X7T
X7R
X7R
X7S
X7S
X7S
X7T
X7T
X7R
X7R
X7R
X7R
X7S
X7T
X7R
X7T
X7T
X7R
X7R
X7T
X7R
X7T
X7R
X7R
X7S
X7R
X7R
X7S
X7S
X7R
X7S
MLCC Construction
• Excessive board bending during PCB manufacturing or final assembling is common, and the brittle nature
Material
No.
1
Name
Cross Section
of ceramic components is especially prone to damage after being soldered to the PCB. TDK has expanded
line of board flex solutions by introducing soft termination capacitor with a conductive resin terminal layer
that protects the ceramic body by absorbing external stress. Soft term caps are also good protection from
brittle solder fillets when using Pb-free solder.
Standard Term
Soft Term
Dielectric
BaTiO
Ni
3
BaTiO3
3
Inner
Electrode
2
Ni
4
5
3
Cu
Cu
6
Board Flex Data
(Bending Test: C3216X7R1C106K)
Temperature Cycle Test Data
(Liquid Phase) -55 to 125degC / Sn-3.0Ag-0.5Cu
Conductive
Resin
4
----
Terminal
Electrode
12.0
>10
11.0
5
Ni
Sn
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
1
2
6
Cross Sectional Analysis
Standard Term
Soft Term
Solder Crack
Standard Term
Soft Term
Min Bending Limit
Soft Term
Standard Term
• Bending test result shows high performance.
• Soft Termination offers superior performance to
standard termination in temperature cycle test.
Crack
Rev. Oct. 2010