Datasheet > C3216X5R1C475M115AA_17

C3216X5R1C475M115AA_17

更新时间： 2024-11-05 01:17:51

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东电化 - TDK		/
页数	文件大小	规格书
3页	235K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : May 24, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C3216X5R1C475M115AA

TDK item description C3216X5R1C475MT****

Commercial Grade

Applications

Please refer to Part No. CGA5L2X5R1C475M160AA for Automotive use.

General General (Up to 50V)

C3216 [EIA 1206]

Production (Not Recommended for New Design)

Feature

Series

Status

Size

3.20mm ±0.20mm

Length(L)

Width(W)

1.60mm ±0.20mm

1.15mm ±0.15mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

1.00mm Min.

2.10mm to 2.50mm(Flow Soldering)

2.00mm to 2.40mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

1.10mm to 1.30mm(Flow Soldering)

1.00mm to 1.20mm(Reﬂow Soldering)

1.00mm to 1.30mm(Flow Soldering)

1.10mm to 1.60mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

4.7μF ±20%

16VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X5R(±15%)

21MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Packing

Blister (Plastic)Taping [180mm Reel]

2000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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