Datasheet > C3216C0G1H473J115AE

C3216C0G1H473J115AE

更新时间： 2024-09-22 01:24:07

品牌	Logo	应用领域
东电化 - TDK		/
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3页	170K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : December 01, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C3216C0G1H473J115AE

TDK item description C3216C0G1H473JT***S

Commercial Grade

Applications

Please refer to Part No. CGA5H2C0G1H473J115AE for Automotive use.

Soft Soft Termination

Feature

Series

Status

C3216 [EIA 1206]

Production

Size

3.20mm +0.40,-0.20mm

Length(L)

Width(W)

1.60mm +0.30,-0.20mm

1.15mm ±0.15mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

1.00mm Min.

2.10mm to 2.50mm(Flow Soldering)

2.00mm to 2.40mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

1.10mm to 1.30mm(Flow Soldering)

1.00mm to 1.20mm(Reﬂow Soldering)

1.00mm to 1.30mm(Flow Soldering)

1.10mm to 1.60mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

47nF ±5%

50VDC

Rated Voltage

Temperature Characteristic

Q (Min.)

C0G(0±30ppm/°C)

1000

Insulation Resistance (Min.)

10000MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Packing

Blister (Plastic)Taping [180mm Reel]

2000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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