5秒后页面跳转
C2012X8R1H104KT PDF预览

C2012X8R1H104KT

更新时间: 2024-11-07 07:05:11
品牌 Logo 应用领域
东电化 - TDK 电容器
页数 文件大小 规格书
2页 279K
描述
Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X8R, 15% TC, 0.1uF, Surface Mount, 0805, CHIP, ROHS AND REACH COMPLIANT

C2012X8R1H104KT 数据手册

 浏览型号C2012X8R1H104KT的Datasheet PDF文件第2页 
C SERIES | Conductive Epoxy  
B
TDK’s Conductive Epoxy Series is a conductive glue-mounted device  
L
W
B
L
Body Length  
rather than solder-mounted.  
In high-temperature environments, the  
W Body Width  
T
B
connectivity reliability is focused on the solder fillet because there are thermal  
expansion coefficient differences between the substrate, MLCC, and solder  
fillet. A conductive glue-mounted device allows for more “flexibility” during  
periods of expansion and contraction because the thermal expansion  
differences have been reduced by using a non-solder attachment.  
T
Body Height  
Terminal Width  
Case Code  
L (mm)  
W (mm)  
T (mm)  
Conductive glue is a common method of mounting components in  
applications that demand reliability at high temperatures, particularly in  
automotive environments. It's also used in applications that cannot be  
subjected to the heat of the solder paste mounting process, such as LCD  
panels, organic EL and LED displays, and CCD devices, which are particularly  
sensitive to high temperatures.  
C1005/0402  
C1608/0603  
C2012/0805  
C3216/1206  
C3225/1210  
1.00  
1.60  
2.00  
3.20  
3.20  
0.50  
0.80  
1.25  
1.60  
2.50  
0.50  
0.80  
1.25  
1.60  
2.50  
Part Number Description  
TEMPERATURE CHARACTERISTICS  
RATED VOLTAGE (DC)  
PACKAGING STYLE  
INTERNAL CODES  
C3216  
X7R  
1E  
106  
K
T
���B  
SERIES NAME & DIMENSION CODE  
CAPACITANCE TOLERANCE  
NOMINAL CAPACITANCE (pF)  
Standard Termination  
AgPdCu Termination  
Features:  
3
3
4
4
5
AgPdCu termination for conductive glue mounting  
Reduce risk of silver migration  
Improved mechanical/thermal strength when use with conductive glue  
AEC Q-200 compliant  
RoHS, WEE, and REACH compliant  
2
2
MATERIAL  
1
1
Applications:  
No.  
NAME  
Class 1  
CaZrO3  
Class 2  
BaTiO3  
MATERIAL  
Transmission control  
Engine sensor module  
No.  
NAME  
(1) Ceramic Dielectric  
(2) Internal Electrode  
(3)  
(4)  
(5)  
Class 1  
Class 2  
Nickel (Ni)  
(1) Ceramic Dielectric  
(2) Internal Electrode  
CaZrO3  
BaTiO3  
Automotive power train  
Anti-Lock Breaking System  
Application requiring conductive glue mounting method  
Copper (Cu)  
Nickel (Ni)  
Tin (Sn)  
Nickel (Ni)  
Copper (Cu)  
AgPdCu  
Termination  
(3)  
Termination  
(4)  
©TDK Corporation of America – Contents are subject to change without notice.  

与C2012X8R1H104KT相关器件

型号 品牌 获取价格 描述 数据表
C2012X8R1H104M125AA TDK

获取价格

Multilayer Ceramic Chip Capacitors
C2012X8R1H104M125AE TDK

获取价格

CAP CER 0.1UF 50V X8R 0805
C2012X8R1H154K125AB TDK

获取价格

Multilayer Ceramic Chip Capacitors
C2012X8R1H154K125AE TDK

获取价格

CAP CER 0.15UF 50V X8R 0805
C2012X8R1H154M125AB TDK

获取价格

Multilayer Ceramic Chip Capacitors
C2012X8R1H154M125AE TDK

获取价格

CAP CER 0.15UF 50V X8R 0805
C2012X8R1H223KT5 TDK

获取价格

Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% -Tol, X8R, 15% TC, 0.022uF, Surface Mount
C2012X8R1H224K125AB TDK

获取价格

Multilayer Ceramic Chip Capacitors
C2012X8R1H224K125AE TDK

获取价格

CAP CER 0.22UF 50V X8R 0805
C2012X8R1H224M125AB TDK

获取价格

Multilayer Ceramic Chip Capacitors