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C2012X8R1E684M125AE PDF预览

C2012X8R1E684M125AE

更新时间: 2024-11-17 01:15:39
品牌 Logo 应用领域
东电化 - TDK /
页数 文件大小 规格书
3页 122K
描述
Multilayer Ceramic Chip Capacitors

C2012X8R1E684M125AE 数据手册

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1 of 3  
Creation Date : May 22, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
C2012X7S1C685K125AC  
TDK item description C2012X7S1C685KT****  
Commercial Grade  
Applications  
Please refer to Part No. CGA4J1X7S1C685K125AC for Automotive use.  
General General (Up to 50V)  
Feature  
Series  
Status  
C2012 [EIA 0805]  
Production  
Size  
2.00mm ±0.20mm  
Length(L)  
Width(W)  
1.25mm ±0.20mm  
1.25mm ±0.20mm  
0.20mm Min.  
Thickness(T)  
Terminal Width(B)  
Terminal Spacing(G)  
0.50mm Min.  
1.00mm to 1.30mm(Flow Soldering)  
0.90mm to 1.20mm(Reflow Soldering)  
Recommended Land Pattern (PA)  
Recommended Land Pattern (PB)  
Recommended Land Pattern (PC)  
1.00mm to 1.20mm(Flow Soldering)  
0.70mm to 0.90mm(Reflow Soldering)  
0.80mm to 1.10mm(Flow Soldering)  
0.90mm to 1.20mm(Reflow Soldering)  
Electrical Characteristics  
Capacitance  
6.8μF ±10%  
16VDC  
Rated Voltage  
Temperature Characteristic  
Dissipation Factor (Max.)  
Insulation Resistance (Min.)  
X7S(±22%)  
7.5%  
14MΩ  
Other  
Wave (Flow)  
Reflow  
Soldering Method  
AEC-Q200  
No  
Packing  
Blister (Plastic)Taping [180mm Reel]  
2000pcs  
Package Quantity  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  

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