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C1812X206K3RLCAUTO PDF预览

C1812X206K3RLCAUTO

更新时间: 2024-10-30 14:50:39
品牌 Logo 应用领域
基美 - KEMET /
页数 文件大小 规格书
19页 1264K
描述
KONNEKT Auto X7R, Ceramic, 20 uF, 10%, 25 VDC, X7R

C1812X206K3RLCAUTO 数据手册

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
X7R with KONNEKTTechnology, 25 – 3,000 VDC  
(Commercial & Automotive Grade)  
Lead-free  
Overview  
Capacitance change is limited to ±15% from −55°C to  
KEMET's X7R with KONNEKT™ technology surface mount  
capacitors are designed for applications where higher  
capacitance and voltage are needed without requiring  
additional board space. KONNEKT high density packaging  
technology uses an innovative Transient Liquid Phase  
Sintering (TLPS) material to create a surface mount multi-  
chip solution for high density packaging.  
+125°C.  
In addition to their use in power supplies, these capacitors  
can be used in industries related to automotive (hybrid),  
telecommunications, medical, military, aerospace,  
semiconductors and test/diagnostic equipment.  
Automotive Grade devices are also available which meet  
the demanding Automotive Electronics Council's AEC-Q200  
qualification requirements  
KEMET’s X7R dielectric features a 125°C maximum  
operating temperature and is considered temperature  
stable. The Electronics Components, Assemblies  
and Materials Association (EIA) characterizes X7R  
dielectric as a Class II material. Components of this  
classification are fixed, ceramic dielectric capacitors  
suited for bypass and decoupling applications or for  
frequencydiscriminating circuits where Q and stability of  
capacitance characteristics are not critical. X7R exhibits  
a predictable change in capacitance with respect to time  
and voltage, boasting a minimal change in capacitance  
with reference to ambient temperature.  
For added reliability, KEMET's flexible termination  
technology is an available option that provides superior  
flex performance over standard termination systems. This  
technology was developed to address flex cracks, which are  
the primary failure mode of MLCCs and typically the result  
of excessive tensile and shear stresses produced during  
board flexure and thermal cycling. Flexible termination  
technology inhibits the transfer of board stress to the rigid  
body of the MLCC, therefore mitigating flex cracks which  
can result in low IR or short circuit failures.  
Benefits  
Applications  
• Commercial and Automotive Grade (AEC-Q200)  
• Industry-leading CV values  
• Capacitance offerings ranging from 2.4 nF – 20 µF  
• DC voltage ratings from 25 – 3,000 V  
• EIA 1812 and 2220 case sizes  
• Operating temperature range of −55°C to +125°C  
• Low ESR and ESL  
• Non-polar device, minimizing installation concerns  
• Lead (Pb)-free, RoHS, and REACH compliant  
• Surface mountable using standard MLCC reflow profiles  
• Flexible termination option available.  
• SMPS (Switch Mode Power Supplies)  
• Lighting ballasts, HID lighting  
• DC/DC Converters  
• Telecom equipment  
• Industrial and medical equipment  
• Filters  
• Snubbers  
• DC Blocking  
• Bypass  
Built Into Tomorrow  
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard  
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com  
C1108_KONNEKT_X7R • 8/25/2021  
1

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