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C1812C104K5GAC PDF预览

C1812C104K5GAC

更新时间: 2024-10-28 05:27:31
品牌 Logo 应用领域
基美 - KEMET 电容器固定电容器
页数 文件大小 规格书
2页 42K
描述
CERAMIC CHIP/STANDARD

C1812C104K5GAC 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:, 1812
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8532.24.00.20风险等级:5.54
电容:0.1 µF电容器类型:CERAMIC CAPACITOR
介电材料:CERAMIC高度:1 mm
JESD-609代码:e3长度:4.5 mm
安装特点:SURFACE MOUNT多层:Yes
负容差:10%端子数量:2
最高工作温度:125 °C最低工作温度:-55 °C
封装形状:RECTANGULAR PACKAGE封装形式:SMT
包装方法:TR, EMBOSSED PLASTIC, 7/13 INCH正容差:10%
额定(直流)电压(URdc):50 V尺寸代码:1812
表面贴装:YES温度特性代码:C0G
温度系数:30ppm/Cel ppm/ °C端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状:WRAPAROUND宽度:3.2 mm
Base Number Matches:1

C1812C104K5GAC 数据手册

 浏览型号C1812C104K5GAC的Datasheet PDF文件第2页 
KEMET®  
CERAMIC CHIP/STANDARD  
FEATURES  
• C0G (NP0), X7R, Z5U and Y5V Dielectrics  
• 10, 16, 25, 50, 100 and 200 Volts  
• Standard End Metalization: Tin-plate over nickel  
barrier  
• Tape and reel packaging per EIA481-1. (See page  
51 for specific tape and reel information.) Bulk  
Cassette packaging (0402, 0603, 0805 only) per  
IEC60286-6 and EIAJ 7201.  
• Available Capacitance Tolerances: 0.10 pF; 0.25  
pF; 0.5 pF; 1%; 2%; 5%; 10%; 20%; and  
+80%-20%  
CAPACITOR OUTLINE DRAWINGS  
TIN PLATE  
L
W
B
T
NICKEL PLATE  
S
CONDUCTIVE  
METALLIZATION  
ELECTRODES  
DIMENSIONS—MILLIMETERS AND (INCHES)  
METRIC  
SIZE CODE  
(Ref only)  
L #  
LENGTH  
W #  
WIDTH  
T (EIA) #  
THICKNESS MAX.  
0.55 (.022)  
B
S
MOUNTING  
TECHNIQUE  
Solder Reflow  
EIA  
SIZE CODE  
BANDWIDTH  
0.20 (0.008)-0.40 (0.016)  
MIN. SEPARATION  
1.0 (.04) .05(.002)  
0.5 (.02) .05 (.002)  
0.3 (.012)  
0402*  
0603*  
0805*  
1206*  
1210*  
1812  
1005  
1608  
2012  
3216  
3225  
4532  
4564  
5650  
5664  
1.6 (.063) 0.15 (.006)  
2.0 (.079) 0.2 (.008)  
3.2 (.126) 0.2 (.008)  
3.2 (.126) 0.2 (.008)  
4.5 (.177) 0.3 (.012)  
4.5 (.177) 0.3 (.012)  
5.6 (.220) 0.4 (.016)  
5.6 (.220) 0.4 (.016)  
0.8 (.032) 0.15 (.006)  
1.25 (.049) 0.2 (.008)  
1.6 (.063) 0.2 (.008)  
2.5 (.098) 0.2 (.008)  
3.2 (.126) 0.3 (.012)  
6.4 (.252) 0.4 (.016)  
5.0 (.197) 0.4 (.016)  
6.3 (.248) 0.4 (.016)  
0.9 (.035)  
1.3 (.051)  
1.5 (.059)  
1.7 (.067)  
1.7 (.067)  
1.7 (.067)  
1.8 (.071)  
2.0 (.079)  
0.35 (.014) 0.15 (.006)  
0.5 (.02) .25 (.010)  
0.5 (.02) .25 (.010)  
0.5 (.02) .25 (.010)  
0.6 (.024) .35 (.014)  
0.6 (.024) .35 (.014)  
0.6 (.024) .35 (.014)  
0.6 (.024) .35 (.014)  
0.7 (.028)  
0.75 (.030)  
N/A  
Solder Wave  
or  
Solder Reflow  
N/A  
N/A  
N/A  
1825*  
2220  
Solder  
Reflow  
N/A  
N/A  
2225  
* Note: Indicates EIA Preferred Case Sizes  
# Note: Different tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette.  
(Standard Chips - For  
Military see page 45)  
CAPACITOR ORDERING INFORMATION  
C 0805 C 103 K 5 R A C*  
CERAMIC  
SIZE CODE  
END METALLIZATION  
C-Standard  
SPECIFICATION  
C - Standard  
CAPACITANCE CODE  
(Tin-plated nickel barrier)  
FAILURE RATE LEVEL  
A- Not Applicable  
Expressed in Picofarads (pF)  
First two digits represent significant figures.  
Third digit specifies number of zeros. (Use 9  
for 1.0 thru 9.9pF. Use 8 for 0.5 through 0.99pF)  
(Example: 2.2pF = 229 or 0.50 pF = 508)  
CAPACITANCE TOLERANCE  
TEMPERATURE CHARACTERISTIC  
Designated by Capacitance  
Change Over Temperature Range  
G – C0G (NP0) ( 30 PPM/°C)  
R – X7R ( 15%)  
B – 0.10pF J – 5%  
C – 0.25pF K – 10%  
U – Z5U (+22%, -56%)  
V – Y5V (+22%, -82%)  
D – 0.5pF  
F – 1%  
G – 2%  
M – 20%  
P – (GMV)  
Z – +80%, -20%  
VOLTAGE  
1 - 100V  
2 - 200V  
5 - 50V  
3 - 25V  
4 - 16V  
8 - 10V  
* Part Number Example: C0805C103K5RAC (14 digits - no spaces)  
38  
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300  

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