Datasheet > C1608X7R1H154K080AB_17

C1608X7R1H154K080AB_17

更新时间： 2024-11-07 01:16:15

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	239K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : May 02, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C1608X7R1H154K080AB

TDK item description C1608X7R1H154KT****

Commercial Grade

Applications

Please refer to Part No. CGA3E3X7R1H154K080AB for Automotive use.

General General (Up to 50V)

C1608 [EIA 0603]

Production (Not Recommended for New Design)

Feature

Series

Status

Size

1.60mm ±0.10mm

Length(L)

Width(W)

0.80mm ±0.10mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

0.30mm Min.

0.70mm to 1.00mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

0.80mm to 1.00mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

0.60mm to 0.80mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

150nF ±10%

50VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X7R(±15%)

3333MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Packing

Punched (Paper)Taping [180mm Reel]

4000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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