Datasheet > C1608X7R1H223KT

C1608X7R1H223KT

更新时间： 2024-11-20 20:57:27

品牌	Logo	应用领域
东电化 - TDK		电容器
页数	文件大小	规格书
2页	279K
描述
Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.022uF, Surface Mount, 0603, CHIP, ROHS AND REACH COMPLIANT

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中文翻译

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替代型号

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C1608X7R1H223KT 数据手册

C SERIES | Conductive Epoxy

TDK’s Conductive Epoxy Series is a conductive glue-mounted device

Body Length

rather than solder-mounted.

In high-temperature environments, the

W Body Width

connectivity reliability is focused on the solder fillet because there are thermal

expansion coefficient differences between the substrate, MLCC, and solder

fillet. A conductive glue-mounted device allows for more “flexibility” during

periods of expansion and contraction because the thermal expansion

differences have been reduced by using a non-solder attachment.

Body Height

Terminal Width

Case Code

L (mm)

W (mm)

T (mm)

Conductive glue is a common method of mounting components in

applications that demand reliability at high temperatures, particularly in

automotive environments. It's also used in applications that cannot be

subjected to the heat of the solder paste mounting process, such as LCD

panels, organic EL and LED displays, and CCD devices, which are particularly

sensitive to high temperatures.

C1005/0402

C1608/0603

C2012/0805

C3216/1206

C3225/1210

1.00

1.60

2.00

3.20

0.50

0.80

1.25

1.60

2.50

0.50

0.80

1.25

1.60

2.50

Part Number Description

TEMPERATURE CHARACTERISTICS

RATED VOLTAGE (DC)

PACKAGING STYLE

INTERNAL CODES

C3216

X7R

106

��B

SERIES NAME & DIMENSION CODE

CAPACITANCE TOLERANCE

NOMINAL CAPACITANCE (pF)

Standard Termination

AgPdCu Termination

Features:

 AgPdCu termination for conductive glue mounting

 Reduce risk of silver migration

 Improved mechanical/thermal strength when use with conductive glue

 AEC Q-200 compliant

 RoHS, WEE, and REACH compliant

MATERIAL

Applications:

No.

NAME

Class 1

CaZrO₃

Class 2

BaTiO₃

MATERIAL

 Transmission control

 Engine sensor module

No.

NAME

(1) Ceramic Dielectric

(2) Internal Electrode

(3)

(4)

(5)

Class 1

Class 2

Nickel (Ni)

(1) Ceramic Dielectric

(2) Internal Electrode

CaZrO₃

BaTiO₃

 Automotive power train

 Anti-Lock Breaking System

 Application requiring conductive glue mounting method

Copper (Cu)

Nickel (Ni)

Tin (Sn)

Nickel (Ni)

Copper (Cu)

AgPdCu

Termination

(3)

Termination

(4)

中文翻译

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C1608X7R1H223KT 替代型号

型号	品牌	替代类型	描述	数据表
06035C223KAT2A	KYOCERA AVX	类似代替	X7R MLCC
GRM188R71H223KA01D	MURATA	类似代替	Chip Monolithic Ceramic Capacitors
CC0603KRX7R9BB223	YAGEO	功能相似	通用型陶瓷电容

与C1608X7R1H223KT相关器件

型号	品牌	获取价格	描述	数据表
C1608X7R1H223M080AA	TDK	获取价格	CAP CER 0.022UF 50V X7R 0603
C1608X7R1H223M080AA_17	TDK	获取价格	Multilayer Ceramic Chip Capacitors
C1608X7R1H223M080AE	TDK	获取价格	CAP CER 0.022UF 50V X7R 0603
C1608X7R1H223MB	TDK	获取价格	Ceramic Capacitor, Multilayer, Ceramic, 50V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.022uF, Sur
C1608X7R1H223MT	TDK	获取价格	Ceramic Capacitor, Multilayer, Ceramic, 50V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.022uF, Sur
C1608X7R1H224K	TDK	获取价格	2012 MLCC PRODUCT GUIDE
C1608X7R1H224K080AB	TDK	获取价格	MULTILAYER CERAMIC CHIP CAPACITORS
C1608X7R1H224K080AB_16	TDK	获取价格	Multilayer Ceramic Chip Capacitors
C1608X7R1H224K080AB_17	TDK	获取价格	Multilayer Ceramic Chip Capacitors
C1608X7R1H224K080AE	TDK	获取价格	CAP CER 0.22UF 50V X7R 0603

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