Datasheet > C1608X5R1H224M080AB_17

C1608X5R1H224M080AB_17

更新时间： 2024-11-05 01:23:03

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	235K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : May 02, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C1608X7R1A225K080AC

TDK item description C1608X7R1A225KT****

Applications

Commercial Grade

Feature

Series

Status

General General (Up to 50V)

C1608 [EIA 0603]

Production

Size

1.60mm ±0.10mm

Length(L)

Width(W)

0.80mm ±0.10mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

0.30mm Min.

0.70mm to 1.00mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

0.80mm to 1.00mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

0.60mm to 0.80mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

2.2μF ±10%

10VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X7R(±15%)

10%

45MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Packing

Punched (Paper)Taping [180mm Reel]

4000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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