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C1608X5R1H154M080AB_17 PDF预览

C1608X5R1H154M080AB_17

更新时间: 2024-11-24 01:20:19
品牌 Logo 应用领域
东电化 - TDK /
页数 文件大小 规格书
3页 236K
描述
Multilayer Ceramic Chip Capacitors

C1608X5R1H154M080AB_17 数据手册

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1 of 3  
Creation Date : May 02, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
C1608X5R1H154K080AB  
TDK item description C1608X5R1H154KT****  
Commercial Grade  
Applications  
Please refer to Part No. CGA3E3X5R1H154K080AB for Automotive use.  
General General (Up to 50V)  
C1608 [EIA 0603]  
Production (Not Recommended for New Design)  
Feature  
Series  
Status  
Size  
1.60mm ±0.10mm  
Length(L)  
Width(W)  
0.80mm ±0.10mm  
0.80mm ±0.10mm  
0.20mm Min.  
Thickness(T)  
Terminal Width(B)  
Terminal Spacing(G)  
0.30mm Min.  
0.70mm to 1.00mm(Flow Soldering)  
0.60mm to 0.80mm(Reflow Soldering)  
Recommended Land Pattern (PA)  
Recommended Land Pattern (PB)  
Recommended Land Pattern (PC)  
0.80mm to 1.00mm(Flow Soldering)  
0.60mm to 0.80mm(Reflow Soldering)  
0.60mm to 0.80mm(Flow Soldering)  
0.60mm to 0.80mm(Reflow Soldering)  
Electrical Characteristics  
Capacitance  
150nF ±10%  
50VDC  
Rated Voltage  
Temperature Characteristic  
Dissipation Factor (Max.)  
Insulation Resistance (Min.)  
X5R(±15%)  
5%  
3333MΩ  
Other  
Wave (Flow)  
Reflow  
Soldering Method  
AEC-Q200  
No  
Packing  
Punched (Paper)Taping [180mm Reel]  
4000pcs  
Package Quantity  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  

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