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C1206C183D2PA

更新时间: 2024-11-13 04:29:31
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基美 - KEMET /
页数 文件大小 规格书
8页 1034K
描述
CERAMIC CHIP CAPACITORS

C1206C183D2PA 数据手册

 浏览型号C1206C183D2PA的Datasheet PDF文件第2页浏览型号C1206C183D2PA的Datasheet PDF文件第3页浏览型号C1206C183D2PA的Datasheet PDF文件第4页浏览型号C1206C183D2PA的Datasheet PDF文件第5页浏览型号C1206C183D2PA的Datasheet PDF文件第6页浏览型号C1206C183D2PA的Datasheet PDF文件第7页 
CERAMIC CHIP CAPACITORS  
FEATURES  
• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics  
• Tape and reel packaging per EIA481-1. (See page  
92 for specific tape and reel information.) Bulk  
Cassette packaging (0402, 0603, 0805 only) per  
IEC60286-6 and EIAJ 7201.  
• 10, 16, 25, 50, 100 and 200 Volts  
• Standard End Metalization: Tin-plate over nickel  
barrier  
• Available Capacitance Tolerances: 0.10 pFꢁ 0.25  
pFꢁ 0.5 pFꢁ 1ꢀꢁ 2ꢀꢁ 5ꢀꢁ 10ꢀꢁ 20ꢀꢁ and  
+80ꢀ-20ꢀ  
• RoHS Compliant  
CAPACITOR OUTLINE DRAWINGS  
TIN PLATE  
L
W
B
T
NICKEL PLATE  
S
CONDUCTIVE  
METALLIZATION  
ELECTRODES  
DIMENSIONS—MILLIMETERS AND (INCHES)  
METRIC  
EIA  
S
SIZE CODE  
EIA SIZE  
METRIC  
T
MOUNTING  
TECHNIQUE  
SIZE CODE  
(Ref only)  
SIZE CODE  
1005  
L - LENGTH  
W - WIDTH  
B - BANDWIDTH  
SEPARATION  
minimum  
CODE  
THICKNESS  
0402*  
0201*  
0603*  
0402*  
0805*  
0603  
1608  
1005  
2012  
0.6 (.024) .03 (.001)  
1.0 (.04) .05 (.002)  
1.6 (.063) .15 (.006)  
2.0 (.079) .20 (.008)  
3.2 (.126) .20 (.008)  
3.2 (.126) .20 (.008)  
4.5 (.177) .30 (.012)  
4.5 (.177) .30 (.012)  
5.6 (.220) .40 (.016)  
5.6 (.220) .40 (.016)  
0.3 (.012) .03 (.001)  
0.5 (.02) .05 (.002)  
0.8 (.032) .15 (.006)  
1.25 (.049) .20 (.008)  
1.6 (.063) .20 (.008)  
2.5 (.098) .20 (.008)  
3.2 (.126) .30 (.012)  
6.4 (.252) .40 (.016)  
5.0 (.197) .40 (.016)  
6.3 (.248) .40 (.016)  
0.15 (.006) .05 (.002)  
0.20 (.008) -.40 (.016)  
0.35 (.014) .15 (.006)  
0.50 (.02) .25 (.010)  
0.50 (.02) .25 (.010)  
0.50 (.02) .25 (.010)  
0.60 (.024) .35 (.014)  
0.60 (.024) .35 (.014)  
0.60 (.024) .35 (.014)  
0.60 (.024) .35 (.014)  
N/A  
0.3 (.012)  
0.7 (.028)  
0.75 (.030)  
N/A  
Solder Reflow  
or  
0603  
1608  
1206*  
3216  
Solder Wave +  
or  
Solder Reflow  
0805*  
2012  
1210*  
3225  
See page 78  
for thickness  
dimensions.  
1206*  
3216  
1812  
4532  
1210*  
1825*  
1812  
3225  
4564  
4532  
N/A  
N/A  
N/A  
N/A  
Solder  
Reflow  
2220  
5650  
1825*  
4564  
Solder Reflow  
2225  
5664  
2220  
5650  
2225  
5664  
N/A  
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)  
+ For extended value 1210 case size - solder reflow only.  
(Standard Chips - For  
Military see page 87)  
CAPACITOR ORDERING INFORMATION  
C 0805 C 103 K 5 R A C*  
CERAMIC  
END METALLIZATION  
SIZE CODE  
C-Standard (Tin-plated nickel barrier)  
SPECIFICATION  
C - Standard  
FAILURE RATE LEVEL  
CAPACITANCE CODE  
A- Not Applicable  
Expressed in Picofarads (pF)  
First two digits represent significant figures.  
Third digit specifies number of zeros. (Use 9  
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)  
(Example: 2.2pF = 229 or 0.50 pF = 508)  
CAPACITANCE TOLERANCE  
B – 0.10pF J – 5ꢀ  
TEMPERATURE CHARACTERISTIC  
Designated by Capacitance  
Change Over Temperature Range  
G – C0G (NP0) ( 30 PPMꢂ/C)  
R – X7R ( 15ꢀ) (-55/C + 125/C)  
P– X5R ( 15ꢀ) (-55/C + 85/C)  
U – Z5U (+22ꢀ, -56ꢀ) (+10/C + 85/C)  
V – Y5V (+22ꢀ, -82ꢀ) (-30/C + 85/C)  
VOLTAGE  
C – 0.25pF K – 10ꢀ  
D – 0.5pF  
F – 1ꢀ  
G – 2ꢀ  
M – 20ꢀ  
P – (GMV) – special order only  
Z – +80ꢀ, -20ꢀ  
1 - 100V  
2 - 200V  
5 - 50V  
7 - 4V  
3 - 25V  
4 - 16V  
8 - 10V  
* Part Number Example: C0805C103K5RAC (14 digits - no spaces)  
9 - 6.3V  
72  
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300  

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