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C1206C104K5RACTU

更新时间: 2024-11-06 01:14:19
品牌 Logo 应用领域
基美 - KEMET /
页数 文件大小 规格书
1页 71K
描述
Ceramic, Commercial-(CxxxxC), 0.1 uF, 10%, 50 V, 1206, X7R, SMD, MLCC, Temperature Stable, Class II

C1206C104K5RACTU 数据手册

  
KEMET Part Number: C1206C104K5RACTU  
(C1206C104K5RAC7800)  
Ceramic, Commercial-(CxxxxC), 0.1 uF, 10%, 50 V, 1206, X7R, SMD, MLCC, Temperature Stable, Class II  
General Information  
Style: SMD Chip  
Series: Commercial-(CxxxxC)  
Chip Size: 1206  
SMD, MLCC, Temperature  
Stable, Class II  
Description:  
Features: Temperature Stable, Class II  
RoHS: Yes  
Termination: Tin  
Marking: No  
Failure Rate: N/A  
Note: Referee time for X7R  
Miscellaneous: dielectric for this part number is  
1000 hours  
Dimensions  
L
W
T
3.2mm +/-0.2mm  
1.6mm +/-0.2mm  
0.78mm +/-0.10mm  
0.5mm +/-0.25mm  
Specifications  
Capacitance: 0.1 uF  
B
Capacitance Tolerance: 10%  
Voltage DC: 50 VDC  
Temperature Range: -55/+125C  
Temperature Coefficient: X7R  
Dissipation Factor: 2.5%  
Packaging Specifications  
Packaging: T&R, 180mm, Plastic Tape  
Packaging Quantity: 4000  
Aging Rate: 3% Loss/Decade Hour  
Insulation Resistance: 10 GOhms  
Dielectric Strength: 125 V  
Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute - and  
we specifically disclaim - any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the  
requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us  
with reference to the use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.  
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C1206C104K5RACTU 替代型号

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C1206C104K5RALTU KEMET

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Ceramic, Commercial-(CxxxxC), 0.1 uF, 10%, 50 V, 1206, X7R, SMD, MLCC, Temperature Stable,
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完全替代

Capacitor, Ceramic, Chip, General Purpose, 0.

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