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C1206C103K2RAC PDF预览

C1206C103K2RAC

更新时间: 2024-11-05 23:15:11
品牌 Logo 应用领域
基美 - KEMET /
页数 文件大小 规格书
2页 42K
描述
CERAMIC CHIP/STANDARD

C1206C103K2RAC 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:1206
包装说明:, 1206Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8532.24.00.20
风险等级:5.21电容:0.01 µF
电容器类型:CERAMIC CAPACITOR介电材料:CERAMIC
高度:0.78 mmJESD-609代码:e3
长度:3.2 mm安装特点:SURFACE MOUNT
多层:Yes负容差:10%
端子数量:2最高工作温度:125 °C
最低工作温度:-55 °C封装形状:RECTANGULAR PACKAGE
封装形式:SMT包装方法:Bulk
正容差:10%额定(直流)电压(URdc):200 V
尺寸代码:1206表面贴装:YES
温度特性代码:X7R温度系数:15% ppm/ °C
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形状:WRAPAROUND
宽度:1.6 mmBase Number Matches:1

C1206C103K2RAC 数据手册

 浏览型号C1206C103K2RAC的Datasheet PDF文件第2页 
KEMET®  
CERAMIC CHIP/STANDARD  
FEATURES  
• C0G (NP0), X7R, Z5U and Y5V Dielectrics  
• 10, 16, 25, 50, 100 and 200 Volts  
• Standard End Metalization: Tin-plate over nickel  
barrier  
• Tape and reel packaging per EIA481-1. (See page  
51 for specific tape and reel information.) Bulk  
Cassette packaging (0402, 0603, 0805 only) per  
IEC60286-6 and EIAJ 7201.  
• Available Capacitance Tolerances: 0.10 pF; 0.25  
pF; 0.5 pF; 1%; 2%; 5%; 10%; 20%; and  
+80%-20%  
CAPACITOR OUTLINE DRAWINGS  
TIN PLATE  
L
W
B
T
NICKEL PLATE  
S
CONDUCTIVE  
METALLIZATION  
ELECTRODES  
DIMENSIONS—MILLIMETERS AND (INCHES)  
METRIC  
SIZE CODE  
(Ref only)  
L #  
LENGTH  
W #  
WIDTH  
T (EIA) #  
THICKNESS MAX.  
0.55 (.022)  
B
S
MOUNTING  
TECHNIQUE  
Solder Reflow  
EIA  
SIZE CODE  
BANDWIDTH  
0.20 (0.008)-0.40 (0.016)  
MIN. SEPARATION  
1.0 (.04) .05(.002)  
0.5 (.02) .05 (.002)  
0.3 (.012)  
0402*  
0603*  
0805*  
1206*  
1210*  
1812  
1005  
1608  
2012  
3216  
3225  
4532  
4564  
5650  
5664  
1.6 (.063) 0.15 (.006)  
2.0 (.079) 0.2 (.008)  
3.2 (.126) 0.2 (.008)  
3.2 (.126) 0.2 (.008)  
4.5 (.177) 0.3 (.012)  
4.5 (.177) 0.3 (.012)  
5.6 (.220) 0.4 (.016)  
5.6 (.220) 0.4 (.016)  
0.8 (.032) 0.15 (.006)  
1.25 (.049) 0.2 (.008)  
1.6 (.063) 0.2 (.008)  
2.5 (.098) 0.2 (.008)  
3.2 (.126) 0.3 (.012)  
6.4 (.252) 0.4 (.016)  
5.0 (.197) 0.4 (.016)  
6.3 (.248) 0.4 (.016)  
0.9 (.035)  
1.3 (.051)  
1.5 (.059)  
1.7 (.067)  
1.7 (.067)  
1.7 (.067)  
1.8 (.071)  
2.0 (.079)  
0.35 (.014) 0.15 (.006)  
0.5 (.02) .25 (.010)  
0.5 (.02) .25 (.010)  
0.5 (.02) .25 (.010)  
0.6 (.024) .35 (.014)  
0.6 (.024) .35 (.014)  
0.6 (.024) .35 (.014)  
0.6 (.024) .35 (.014)  
0.7 (.028)  
0.75 (.030)  
N/A  
Solder Wave  
or  
Solder Reflow  
N/A  
N/A  
N/A  
1825*  
2220  
Solder  
Reflow  
N/A  
N/A  
2225  
* Note: Indicates EIA Preferred Case Sizes  
# Note: Different tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette.  
(Standard Chips - For  
Military see page 45)  
CAPACITOR ORDERING INFORMATION  
C 0805 C 103 K 5 R A C*  
CERAMIC  
SIZE CODE  
END METALLIZATION  
C-Standard  
SPECIFICATION  
C - Standard  
CAPACITANCE CODE  
(Tin-plated nickel barrier)  
FAILURE RATE LEVEL  
A- Not Applicable  
Expressed in Picofarads (pF)  
First two digits represent significant figures.  
Third digit specifies number of zeros. (Use 9  
for 1.0 thru 9.9pF. Use 8 for 0.5 through 0.99pF)  
(Example: 2.2pF = 229 or 0.50 pF = 508)  
CAPACITANCE TOLERANCE  
TEMPERATURE CHARACTERISTIC  
Designated by Capacitance  
Change Over Temperature Range  
G – C0G (NP0) ( 30 PPM/°C)  
R – X7R ( 15%)  
B – 0.10pF J – 5%  
C – 0.25pF K – 10%  
U – Z5U (+22%, -56%)  
V – Y5V (+22%, -82%)  
D – 0.5pF  
F – 1%  
G – 2%  
M – 20%  
P – (GMV)  
Z – +80%, -20%  
VOLTAGE  
1 - 100V  
2 - 200V  
5 - 50V  
3 - 25V  
4 - 16V  
8 - 10V  
* Part Number Example: C0805C103K5RAC (14 digits - no spaces)  
38  
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300  

C1206C103K2RAC 替代型号

型号 品牌 替代类型 描述 数据表
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SMD Comm X7R Flex, Ceramic, 0.01 uF, 10%, 200 VDC, X7R, SMD, MLCC, FT-CAP, Temperature Sta
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