Datasheet > C10-642449-001

C10-642449-001

更新时间： 2022-04-21 07:24:53

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Amphenol Industrial RADSOK Products for Printed Circuit Boards

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C10-642449-001 数据手册

Product Data Sheet

Amphenol^®Industrial RADSOK^®Products for

Printed Circuit Boards

No. 205

PROBLEM: With conventional interconnects, users often cannot handle the higher power requirements of

modern electronics board applications. A common solution to increase amperage to the board is to increase

the thickness of the copper layers (i.e. traces) in the PCB or backplane. This is usually costly and traps heat

within the PCB. Other options are to bring in additional wires either attached to or plugged into the board

creating a cumbersome wire bundle. The bundle of wire often takes up excessive space behind the board and

doesn’t allow proper air flow, which may cause failures of heat-sensitive components like processors. This

method can be labor intensive and may require special crimping and assembly tools as well.

THE AMPHENOL^®RADSOK^®SOLUTION TO BRING MORE POWER

TO THE BOARD . . . . Three high amperage products: PowerBlok, RADSERT, PGY

Amphenol’s RADSOK^®solution offers many options for high current

single-point connections to printed circuit boards. The compact

footprint design can supply up to 120 Amp to the board which

preserves surface area and provides more flexibility in board design.

The RADSOK^®hyperbolic grid

contact design gives more surface

area with many points of contact for

heat dissipation at the pin and

socket interface.

This lowers temperature rise and

reduces potential failures.

RADSOK^®PCB products are

designed to be applied manually

(press-fit) or by a reflow solder

process, which eliminates the need for additional wires and/or special

crimp tools.

Amphe-Power with RADSOK^®Sockets

Contact Ratings

Size 12

Size 8

Size 4

Size 0

35 Amps

70 Amps

120 Amps

250 Amps

RADSOK^®PCB PowerBlok^TM

RADSOK^®PowerBlok provides a high current single-point connection to the PCB with the

proven reliability of compliant pin signals. The PowerBlok is designed to bring up to 70 Amps to

the board, utilizing our custom 3.0mm RADSOK^®design. The compliant pins are press-fit into

the board to secure a solid connection and even signal flow.

• High power to board interconnect in a small package

• Compact footprint 0.618” x 0.618”

• 3.0mm RADSOK^®carries up to 70 amperes

• Backplane power interface with compliant pins for signals

• Touchproof cover

• Radial design ensures many points of contact

• Reduces failure modes, eliminates burn outs

• No threaded fasteners

• No special crimp tools required

• Eliminates possible stress fractures in board

• Faster through-put

• RoHs compliant

High power density in a small

footprint ( approx. 1/2” x 1/2”)

Tooled to 3.0mm (70 amp) size

Sample part number: C10-639323-000 designates a 3.0mm PowerBlok with compliant pins.

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