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C0805C331KARAC

更新时间： 2024-11-14 14:48:15
品牌 Logo 应用领域
基美 - KEMET 电容器
页数 文件大小 规格书
3页 95K
描述
Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.00033uF, Surface Mount, 0805, CHIP, ROHS COMPLIANT

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C0805C331KARAC 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：, 0805
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8532.24.00.20风险等级：5.24
电容：0.00033 µF电容器类型：CERAMIC CAPACITOR
介电材料：CERAMIC高度：0.78 mm
JESD-609代码：e3长度：2 mm
安装特点：SURFACE MOUNT多层：Yes
负容差：10%端子数量：2
最高工作温度：125 °C最低工作温度：-55 °C
封装形状：RECTANGULAR PACKAGE封装形式：SMT
包装方法：BULK正容差：10%
额定（直流）电压（URdc）：250 V尺寸代码：0805
表面贴装：YES温度特性代码：X7R
温度系数：15% ppm/ °C端子面层：Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状：WRAPAROUND宽度：1.25 mm
Base Number Matches：1

C0805C331KARAC 数据手册

 浏览型号C0805C331KARAC的Datasheet PDF文件第2页浏览型号C0805C331KARAC的Datasheet PDF文件第3页 
Product Specification Bulletin  
Surface Mount Tip & Ring Ceramic Chip Capacitors  
KEMET’s 250 VDC or Tip & Ring MLCC capacitors are designed and rated for telecommunication ringer cir-  
cuits where the capacitor is used to block -48 to -52 Volt DC of line voltage and pass a 16-25 Hz AC signal pulse  
of 70 Vrms to 90 Vrms. The surface mount ceramic capacitors are excellent replacements for high voltage leaded  
film devices. The smaller SMT footprints save valuable board space which is critical when creating new designs,  
and the capacitors are able to withstand today’s higher lead-free reflow processing temperatures. The ceramic  
MLCC have excellent high frequency filtering characteristics, low ESR, and high temperature reflow capabilities.  
KEMET Tip and Ring capacitors are available in standard EIA case sizes and standard capacitance values from  
0.001μF to 1.2μF. The capacitors have pure tin (100% Matte Sn) plated terminations and are 100% lead free which  
is ideal for new environmentally demanding designs.  
Applications:  
Markets:  
• Telecommunication Ringing Circuits  
• Switch Mode Power Supply Snubber Circuits  
• High Voltage DC Blocking  
• High Voltage Coupling  
• Phone Lines  
• Analog and Digital Modems  
• FAX Machines  
• Wireless Base Stations, Ethernet  
• Digital Video Recording Set-Top Boxes  
• Satellite Dish  
• Cable Set-Top Boxes  
• High Voltage Power Supply, DC/DC Converters  
• Ethernet, POS, ATM Hardware  
Outline Drawing  
L
TIN PLATE  
W
T
B
NICKEL PLATE  
S
ELECTRODES  
CONDUCTIVE METALLIZATION  
Table 1 – Dimensions - Millimeters (Inches)  
Metric Code  
EIA Size Code  
L - Length  
W - Width  
B - Bandwidth  
Band Separation  
2.0 (0.079)  
± 0.2 (0.008)  
1.2 (0.049  
± 0.2 (0.008)  
0.5 (0.02)  
± 0.25 (0.010)  
2012  
0805  
0.75 (0.030)  
3.2 (0.126)  
± 0.2 (0.008)  
1.6 (0.063)  
± 0.2 (0.008)  
0.5 (0.02)  
± 0.25 (0.010)  
3216  
3225  
4532  
4564  
5650  
5664  
1206  
1210  
1812  
1825  
2220  
2225  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
3.2 (0.126)  
± 0.2 (0.008)  
2.5 (0.098)  
± 0.2 (0.008)  
0.5 (0.02)  
± 0.25 (0.010)  
4.5 (0.177)  
± 0.3 (0.012)  
3.2 (0.126)  
± 0.3 (0.012)  
0.6 (0.024)  
± 0.35 (0.014)  
4.5 (0.177)  
± 0.3 (0.012)  
6.4 (0.250)  
± 0.4 (0.016)  
0.6 (0.024)  
± 0.35 (0.014)  
5.6 (0.224)  
± 0.4 (0.016)  
5.0 (0.197)  
± 0.4 (0.016)  
0.6 (0.024)  
± 0.35 (0.014)  
5.6 (0.224)  
± 0.4 (0.016)  
6.4 (0.250)  
± 0.4 (0.016)  
0.6 (0.024)  
± 0.35 (0.014)  
Note: For thickness dimensions, see Table 2.  
F-9033D 11/07  
123

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