CERAMIC CHIP CAPACITORS
FEATURES
• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
• Tape and reel packaging per EIA481-1. (See page
92 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
• 10, 16, 25, 50, 100 and 200 Volts
• Standard End Metalization: Tin-plate over nickel
barrier
• Available Capacitance Tolerances: 0.10 pFꢁ 0.25
pFꢁ 0.5 pFꢁ 1ꢀꢁ 2ꢀꢁ 5ꢀꢁ 10ꢀꢁ 20ꢀꢁ and
+80ꢀ-20ꢀ
• RoHS Compliant
CAPACITOR OUTLINE DRAWINGS
TIN PLATE
L
W
B
T
NICKEL PLATE
S
CONDUCTIVE
METALLIZATION
ELECTRODES
DIMENSIONS—MILLIMETERS AND (INCHES)
METRIC
EIA
S
SIZE CODE
EIA SIZE
METRIC
T
MOUNTING
TECHNIQUE
SIZE CODE
(Ref only)
SIZE CODE
1005
L - LENGTH
W - WIDTH
B - BANDWIDTH
SEPARATION
minimum
CODE
THICKNESS
0402*
0201*
0603*
0402*
0805*
0603
1608
1005
2012
0.6 (.024) .03 (.001)
1.0 (.04) .05 (.002)
1.6 (.063) .15 (.006)
2.0 (.079) .20 (.008)
3.2 (.126) .20 (.008)
3.2 (.126) .20 (.008)
4.5 (.177) .30 (.012)
4.5 (.177) .30 (.012)
5.6 (.220) .40 (.016)
5.6 (.220) .40 (.016)
0.3 (.012) .03 (.001)
0.5 (.02) .05 (.002)
0.8 (.032) .15 (.006)
1.25 (.049) .20 (.008)
1.6 (.063) .20 (.008)
2.5 (.098) .20 (.008)
3.2 (.126) .30 (.012)
6.4 (.252) .40 (.016)
5.0 (.197) .40 (.016)
6.3 (.248) .40 (.016)
0.15 (.006) .05 (.002)
0.20 (.008) -.40 (.016)
0.35 (.014) .15 (.006)
0.50 (.02) .25 (.010)
0.50 (.02) .25 (.010)
0.50 (.02) .25 (.010)
0.60 (.024) .35 (.014)
0.60 (.024) .35 (.014)
0.60 (.024) .35 (.014)
0.60 (.024) .35 (.014)
N/A
0.3 (.012)
0.7 (.028)
0.75 (.030)
N/A
Solder Reflow
or
0603
1608
1206*
3216
Solder Wave +
or
Solder Reflow
0805*
2012
1210*
3225
See page 78
for thickness
dimensions.
1206*
3216
1812
4532
1210*
1825*
1812
3225
4564
4532
N/A
N/A
N/A
N/A
Solder
Reflow
2220
5650
1825*
4564
Solder Reflow
2225
5664
2220
5650
2225
5664
N/A
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)
+ For extended value 1210 case size - solder reflow only.
(Standard Chips - For
Military see page 87)
CAPACITOR ORDERING INFORMATION
C 0805 C 103 K 5 R A C*
CERAMIC
END METALLIZATION
SIZE CODE
C-Standard (Tin-plated nickel barrier)
SPECIFICATION
C - Standard
FAILURE RATE LEVEL
CAPACITANCE CODE
A- Not Applicable
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – 0.10pF J – 5ꢀ
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) ( 30 PPMꢂ/C)
R – X7R ( 15ꢀ) (-55/C + 125/C)
P– X5R ( 15ꢀ) (-55/C + 85/C)
U – Z5U (+22ꢀ, -56ꢀ) (+10/C + 85/C)
V – Y5V (+22ꢀ, -82ꢀ) (-30/C + 85/C)
VOLTAGE
C – 0.25pF K – 10ꢀ
D – 0.5pF
F – 1ꢀ
G – 2ꢀ
M – 20ꢀ
P – (GMV) – special order only
Z – +80ꢀ, -20ꢀ
1 - 100V
2 - 200V
5 - 50V
7 - 4V
3 - 25V
4 - 16V
8 - 10V
* Part Number Example: C0805C103K5RAC (14 digits - no spaces)
9 - 6.3V
72
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300