Datasheet > C0603C0G1H330K030BA_17

C0603C0G1H330K030BA_17

更新时间： 2024-11-05 01:24:51

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	181K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : March 27, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C0603C0G1H330K030BA

TDK item description C0603C0G1H330KT****

Applications

Commercial Grade

Feature

Series

Status

General General (Up to 50V)

C0603 [EIA 0201]

Production (Not Recommended for New Design)

Size

Length(L)

0.60mm ±0.03mm

Width(W)

0.30mm ±0.03mm

0.10mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

0.20mm Min.

0.25mm to 0.35mm

0.20mm to 0.30mm

0.25mm to 0.35mm

Electrical Characteristics

Capacitance

33pF ±10%

50VDC

Rated Voltage

Temperature Characteristic

Q (Min.)

C0G(0±30ppm/°C)

1000

Insulation Resistance (Min.)

10000MΩ

Other

Soldering Method

AEC-Q200

Reﬂow

Packing

Punched (Paper)Taping [180mm Reel]

15000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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