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C005ZK4R7ABSTR500 PDF预览

C005ZK4R7ABSTR500

更新时间: 2024-10-29 02:26:19
品牌 Logo 应用领域
京瓷/艾维克斯 - KYOCERA AVX /
页数 文件大小 规格书
25页 1238K
描述
Thin-Film Technology

C005ZK4R7ABSTR500 数据手册

 浏览型号C005ZK4R7ABSTR500的Datasheet PDF文件第19页浏览型号C005ZK4R7ABSTR500的Datasheet PDF文件第20页浏览型号C005ZK4R7ABSTR500的Datasheet PDF文件第21页浏览型号C005ZK4R7ABSTR500的Datasheet PDF文件第22页浏览型号C005ZK4R7ABSTR500的Datasheet PDF文件第24页浏览型号C005ZK4R7ABSTR500的Datasheet PDF文件第25页 
®
Accu-P  
Application Notes  
GENERAL  
HANDLING  
Accu-P® SMD capacitors are designed for soldering to printed  
circuit boards or other substrates. The construction of the  
components is such that they will withstand the time/temper-  
ature profiles used in both wave and reflow soldering meth-  
ods.  
SMD capacitors should be handled with care to avoid damage  
or contamination from perspiration and skin oils. The use of  
plastic tipped tweezers or vacuum pick-ups is strongly recom-  
mended for individual components. Bulk handling should  
ensure that abrasion and mechanical shock are minimized. For  
automatic equipment, taped and reeled product gives the  
ideal medium for direct presentation to the placement  
machine.  
CIRCUIT BOARD TYPE  
COMPONENT PAD DESIGN  
The circuit board types which may be used with Accu-P® are  
as follows:  
Component pads must be designed to achieve good  
joints and minimize component movement during reflow  
soldering. Pad designs are given below for both wave and  
reflow soldering.  
All flexible types of circuit boards  
(eg. FR-4, G-10) and also alumina.  
For other circuit board materials, please consult factory.  
The basis of these designs is:  
a. Pad width equal to component width. It is permissible to  
decrease this to as low as 85ꢁ of component width but  
it is not advisable to go below this.  
b. Pad overlap 0.5mm beneath large components. Pad  
overlap about 0.3mm beneath small components.  
c. Pad extension of 0.5mm for reflow of large components  
and pad extension about 0.3mm for reflow of small com-  
ponents. Pad extension about 1.0mm for wave soldering.  
REFLOW SOLDERING  
PAD DIMENSIONS: millimeters (inches)  
01005  
0201  
0402  
0603  
0805  
1210  
Accu-P®  
Accu-P®  
Accu-P®  
Accu-P®  
Accu-P®  
Accu-P®  
0.17  
(0.007)  
0.22  
(0.009)  
0.26  
(-0.010)  
0.6  
(0.024)  
0.85  
(0.033)  
1.0  
(0.039)  
1.0  
(0.039)  
0.20  
(0.008)  
0.78  
0.26  
(0.030) (-0.010)  
0.26  
(-0.010)  
1.7  
0.5  
2.3  
0.6  
(0.068) (0.020)  
(0.091) (0.024)  
0.34  
(0.013)  
3.0  
1.0  
0.6  
(0.024)  
(0.118) (0.039)  
0.85  
(0.033)  
4.0  
2.0  
0.55  
(0.022)  
(0.157) (0.079)  
0.8 (0.031)  
1.0  
(0.039)  
1.25 (0.049)  
1.0  
(0.039)  
2.5 (0.098)  
050118  
28  

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