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C005ZJ680CBWTR500 PDF预览

C005ZJ680CBWTR500

更新时间: 2024-10-29 02:26:15
品牌 Logo 应用领域
京瓷/艾维克斯 - KYOCERA AVX /
页数 文件大小 规格书
25页 1238K
描述
Thin-Film Technology

C005ZJ680CBWTR500 数据手册

 浏览型号C005ZJ680CBWTR500的Datasheet PDF文件第18页浏览型号C005ZJ680CBWTR500的Datasheet PDF文件第19页浏览型号C005ZJ680CBWTR500的Datasheet PDF文件第20页浏览型号C005ZJ680CBWTR500的Datasheet PDF文件第22页浏览型号C005ZJ680CBWTR500的Datasheet PDF文件第23页浏览型号C005ZJ680CBWTR500的Datasheet PDF文件第24页 
®
Accu-P  
Environmental ꢀ Mechanical Characteristics  
ENVIRONMENTAL CHARACTERISTICS  
TEST  
CONDITIONS  
REQUIREMENT  
Life (Endurance)  
MIL-STD-202F Method 108A  
125ꢀC, 2UR,1000 hours  
No visible damage  
Δ C/C ≤ 2ꢁ for C≥5pF  
Δ C ≤ 0.25pF for C<5pF  
Accelerated Damp  
Heat Steady State  
MIL-STD-202F Method 103B  
85ꢀC, 85ꢁ RH, UR, 1000 hours  
-55ꢀC to +125ꢀC, 15 cycles – Accu-P®  
260ꢀC 5ꢀC for 10 secs  
No visible damage  
Δ C/C ≤ 2ꢁ for C≥5pF  
Δ C ≤ 0.25pF for C<5pF  
Temperature Cycling  
MIL-STD-202F Method 107E  
MIL-STD-883D Method 1010.7  
No visible damage  
Δ C/C ≤ 2ꢁ for C≥5pF  
Δ C ≤ 0.25pF for C<5pF  
Resistance to Solder Heat  
IEC-68-2-58  
C remains within initial limits  
MECHANICAL CHARACTERISTICS  
TEST  
CONDITIONS  
REQUIREMENT  
Solderability  
IEC-68-2-58  
Components completely immersed in a  
solder bath at 235ꢀC for 2 secs.  
Terminations to be well tinned, minimum 95ꢁ  
coverage  
Leach Resistance  
IEC-68-2-58  
Components completely immersed in a  
solder bath at 260 5ꢀC for 60 secs.  
Dissolution of termination faces ≤15ꢁ of area  
Dissolution of termination edges ≤25ꢁ of length  
Adhesion  
A force of 5N applied for 10 secs.  
No visible damage  
MIL-STD-202F Method 211A  
Termination Bond Strength  
IEC-68-2-21 Amend. 2  
Tested as shown in diagram  
No visible damage  
Δ C/C ≤ 2ꢁ for C≥5pF  
Δ C ≤ 0.25pF for C<5pF  
D = 3mm Accu-P  
D = 1mm Accu-F  
Robustness of Termination  
IEC-68-2-21 Amend. 2  
A force of 5N applied for 10 secs.  
55Hz to 2000Hz, 20G  
No visible damage  
No visible damage  
High Frequency Vibration  
MIL-STD-202F Method 201A,  
®
204D (Accu-P only)  
Storage  
12 months minimum with components  
stored in “as received” packaging  
Good solderability  
Average capacitance with histogram printout for  
capacitance distribution;  
QUALITY & RELIABILITY  
Accu-P® is based on well established thin-film technology  
and materials.  
IR and Breakdown Voltage distribution;  
Temperature Coefficient;  
Solderability;  
• ON-LINE PROCESS CONTROL  
Dimensional, mechanical and temperature stability.  
This program forms an integral part of the production cycle  
and acts as a feedback system to regulate and control  
production processes. The test procedures, which are  
integrated into the production process, were developed  
after long research work and are based on the highly  
developed semiconductor industry test procedures and  
equipment. These measures help AVX to produce a con-  
sistent and high yield line of products.  
QUALITY ASSURANCE  
The reliability of these thin-film chip capacitors has been  
studied intensively for several years. Various measures  
have been taken to obtain the high reliability required today  
by the industry. Quality assurance policy is based on well  
established international industry standards. The reliability  
of the capacitors is determined by accelerated testing  
under the following conditions:  
• FINAL QUALITY INSPECTION  
Life (Endurance)  
Accelerated Damp  
Heat Steady State  
125ꢀC, 2UR, 1000 hours  
Finished parts are tested for standard electrical parameters  
and visual/mechanical characteristics. Each production lot  
is 100ꢁ evaluated for: capacitance and proof voltage at  
2.5 UR. In addition, production is periodically evaluated for:  
85ꢀC, 85ꢁ RH, UR,  
1000 hours.  
050118  
26  

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