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BZX84CXXXET3

更新时间： 2024-11-17 03:14:39
品牌 Logo 应用领域
安森美 - ONSEMI 稳压器
页数 文件大小 规格书
6页 75K
描述
Zener Voltage Regulators 225 mW SOT-23 Surface Mount

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BZX84C2V4ET1 Series  
Zener Voltage Regulators  
225 mW SOT−23 Surface Mount  
This series of Zener diodes is offered in the convenient, surface  
mount plastic SOT−23 package. These devices are designed to provide  
voltage regulation with minimum space requirement. They are well  
suited for applications such as cellular phones, hand held portables,  
and high density PC boards.  
http://onsemi.com  
3
1
Cathode  
Anode  
Specification Features  
• 225 mW Rating on FR−4 or FR−5 Board  
• Zener Breakdown Voltage Range − 2.4 V to 75 V  
• Package Designed for Optimal Automated Board Assembly  
• Small Package Size for High Density Applications  
• ESD Rating of Class 3 (>16 kV) per Human Body Model  
• Peak Power − 225 W (8 X 20 ms)  
3
1
2
SOT−23  
• Pb−Free Packages are Available  
CASE 318  
STYLE 8  
Mechanical Characteristics  
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V−0  
MARKING DIAGRAM  
xxx M G  
G
1
MAXIMUM RATINGS  
xxx  
M
= Device Code  
= Date Code*  
Rating  
Symbol  
Max  
Unit  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
Peak Power Dissipation @ 20 ms (Note 1)  
P
225  
W
pk  
@ T ≤ 25°C  
L
*Date Code orientation may vary depending  
upon manufacturing location.  
Total Power Dissipation on FR−5 Board,  
P
D
(Note 2) @ T = 25°C  
225  
1.8  
mW  
mW/°C  
A
Derated above 25°C  
ORDERING INFORMATION  
Thermal Resistance, Junction−to−Ambient  
Total Power Dissipation on Alumina Sub-  
R
556  
°C/W  
†
q
JA  
Device  
Package  
Shipping  
P
D
BZX84CxxxET1  
SOT−23  
3000/Tape & Reel  
3000/Tape & Reel  
strate, (Note 3) @ T = 25°C  
300  
2.4  
mW  
mW/°C  
A
Derated above 25°C  
BZX84CxxxET1G SOT−23  
(Pb−Free)  
Thermal Resistance, Junction−to−Ambient  
Junction and Storage Temperature Range  
R
q
417  
°C/W  
°C  
JA  
BZX84CxxxET3  
SOT−23 10,000/Tape & Reel  
T , T  
J
−65 to  
+150  
stg  
BZX84CxxxET3G SOT−23 10,000/Tape & Reel  
(Pb−Free)  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
1. Nonrepetitive current pulse per Figure 9.  
2. FR−5 = 1.0 X 0.75 X 0.62 in.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
3. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 3 of  
this data sheet.  
©
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
August, 2005 − Rev. 5  
BZX84C2V4ET1/D  
 
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