BZX84C2V4ET1 Series
Zener Voltage Regulators
225 mW SOT−23 Surface Mount
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT−23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
http://onsemi.com
3
1
Cathode
Anode
Specification Features
• 225 mW Rating on FR−4 or FR−5 Board
• Zener Breakdown Voltage Range − 2.4 V to 75 V
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• Peak Power − 225 W (8 X 20 ms)
3
1
2
SOT−23
• Pb−Free Packages are Available
CASE 318
STYLE 8
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
MARKING DIAGRAM
xxx M G
G
1
MAXIMUM RATINGS
xxx
M
= Device Code
= Date Code*
Rating
Symbol
Max
Unit
G
= Pb−Free Package
(Note: Microdot may be in either location)
Peak Power Dissipation @ 20 ms (Note 1)
P
225
W
pk
@ T ≤ 25°C
L
*Date Code orientation may vary depending
upon manufacturing location.
Total Power Dissipation on FR−5 Board,
P
D
(Note 2) @ T = 25°C
225
1.8
mW
mW/°C
A
Derated above 25°C
ORDERING INFORMATION
Thermal Resistance, Junction−to−Ambient
Total Power Dissipation on Alumina Sub-
R
556
°C/W
†
q
JA
Device
Package
Shipping
P
D
BZX84CxxxET1
SOT−23
3000/Tape & Reel
3000/Tape & Reel
strate, (Note 3) @ T = 25°C
300
2.4
mW
mW/°C
A
Derated above 25°C
BZX84CxxxET1G SOT−23
(Pb−Free)
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
R
q
417
°C/W
°C
JA
BZX84CxxxET3
SOT−23 10,000/Tape & Reel
T , T
J
−65 to
+150
stg
BZX84CxxxET3G SOT−23 10,000/Tape & Reel
(Pb−Free)
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Nonrepetitive current pulse per Figure 9.
2. FR−5 = 1.0 X 0.75 X 0.62 in.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
3. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
©
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
August, 2005 − Rev. 5
BZX84C2V4ET1/D