BZX84C2V4 - BZX84C39
Lead-free
350mW SURFACE MOUNT ZENER DIODE
SPICE MODELS: BZX84C2V4 BZX84C2V7 BZX84C3V0 BZX84C3V3 BZX84C3V6 BZX84C3V9
BZX84C4V3 BZX84C4V7 BZX84C5V1 BZX84C5V6 BZX84C6V2 BZX84C6V8 BZX84C7V5 BZX84C8V2
BZX84C9V1 BZX84C10 BZX84C11 BZX84C12 BZX84C13 BZX84C15 BZX84C16 BZX84C18 BZX84C20
BZX84C22 BZX84C24 BZX84C27 BZX84C30 BZX84C33 BZX84C36 BZX84C39
Features
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Planar Die Construction
SOT-23
Min
350mW Power Dissipation
A
Dim
A
Max
0.51
1.40
2.50
1.03
0.60
2.05
3.00
0.10
1.10
0.61
0.180
8°
Zener Voltages from 2.4V - 39V
0.37
1.20
2.30
0.89
0.45
1.78
2.80
0.013
0.903
0.45
0.085
0°
Ideally Suited for Automated Assembly Processes
Lead Free/RoHS Compliant (Note 4)
Qualified to AEC-Q101 Standards for High Reliability
B
C
B
C
TOP VIEW
D
D
E
G
Mechanical Data
E
H
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Case: SOT-23
G
H
K
M
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Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
J
L
J
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Moisture Sensitivity: Level 1 per J-STD-020C
K
Terminals: Solderable per MIL-STD-202, Method 208
L
Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe).
M
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Polarity: See Diagram
a
Marking: Marking Code & Date Code (See Page 4)
Weight: 0.008 grams (approximate)
All Dimensions in mm
@ TA = 25°C unless otherwise specified
Maximum Ratings
Characteristic
Symbol
VF
Value
0.9
Unit
V
Forward Voltage
@ IF = 10mA
Pd
Power Dissipation (Note 1)
Power Disspation (Note 3)
300
mW
mW
°C/W
°C/W
°C
Pd
350
R
qJA
Thermal Resistance, Junction to Ambient Air (Note 1)
Thermal Resistance, Junction to Ambient Air (Note 3)
Operating and Storage Temperature Range
417
R
qJA
357
Tj, TSTG
-65 to +150
Notes: 1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration test pulse used to minimize self-heating effect.
3. Valid provided the terminals are kept at ambient temperature.
4. No purposefully added lead.
DS18001 Rev. 25 - 2
1 of 4
BZX84C2V4 - BZX84C39
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ã Diodes Incorporated