BZT52C3V9LP

更新时间： 2024-11-23 09:04:31

品牌	Logo	应用领域
美台 - DIODES		稳压二极管
页数	文件大小	规格书
4页	150K
描述
SURFACE MOUNT ZENER DIODE

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中文翻译

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数据手册

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BZT52C3V9LP 数据手册

BZT52C2V4LP - BZT52C39LP

SURFACE MOUNT ZENER DIODE

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Features

Mechanical Data

•

Ultra-Small Leadless Surface Mount Package

•

Case: DFN1006-2

Case Material: Molded Plastic, "Green" Molding Compound.

UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020D

Terminal Connections: Cathode Dot (See Marking Information)

Ideally Suited for Automated Assembly Processes

Lead Free By Design/RoHS Compliant (Note 1)

"Green" Device (Note 2)

•

Qualified to AEC-Q101 Standards for High Reliability

Terminals: Finish ⎯ NiPdAu Over Copper Leadframe.

Solderable per MIL-STD-202, Method 208

•

Marking Information: See Page 3

Ordering Information: See Page 3

Weight: 0.001 grams

Bottom View

Maximum Ratings @T_A= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

0.9

Forward Voltage (Note 4)

@ I_F= 10mA

V_F

Thermal Characteristics

Characteristic

Symbol

P_D

Value

250

Unit

Power Dissipation

(Note 3) T_A= 25°C

500

Thermal Resistance, Junction to Ambient Air

Operating and Storage Temperature Range

°C/W

°C

R_θ

-65 to +150

T_J,T_STG

Notes:

1. No purposefully added lead.

2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

3. Device mounted on FR-4 PCB with minimum recommended pad layout pattern as shown on page 4.

4. Short duration pulse test used to minimize self-heating effect.

1 of 4

www.diodes.com

August 2008

BZT52C2V4LP - BZT52C39LP

Document number: DS30506 Rev. 17 - 2

12 3 4

中文翻译

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