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BZT52C3V0Q PDF预览

BZT52C3V0Q

更新时间: 2024-12-02 13:45:39
品牌 Logo 应用领域
美台 - DIODES 二极管齐纳二极管
页数 文件大小 规格书
3页 74K
描述
SURFACE MOUNT ZENER DIODE

BZT52C3V0Q 数据手册

 浏览型号BZT52C3V0Q的Datasheet PDF文件第2页浏览型号BZT52C3V0Q的Datasheet PDF文件第3页 
BZT52C2V4 - BZT52C39  
SURFACE MOUNT ZENER DIODE  
Features  
·
·
·
·
Planar Die Construction  
500mW Power Dissipation on Ceramic PCB  
General Purpose, Medium Current  
Ideally Suited for Automated Assembly  
Processes  
SOD-123  
Dim  
A
Min  
3.55  
2.55  
1.40  
Max  
3.85  
2.85  
1.70  
1.35  
H
D
J
B
Mechanical Data  
G
C
·
·
·
·
Case: SOD-123, Plastic  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020A  
Terminals: Solderable per MIL-STD-202,  
Method 208  
a
D
A
B
E
0.55 Typical  
0.25  
0.11 Typical  
G
H
E
C
·
·
·
·
Polarity: Cathode Band  
Marking: See Below  
Weight: 0.01 grams (approx.)  
Ordering Information: See Page 4  
J
0.10  
a
0°  
8°  
All Dimensions in mm  
@ TA = 25°C unless otherwise specified  
Maximum Ratings  
Characteristic  
Symbol  
VF  
Value  
0.9  
Unit  
V
Forward Voltage (Note 2)  
Power Dissipation (Note 1)  
@ IF = 10mA  
Pd  
500  
mW  
°C/W  
°C  
RqJA  
Thermal Resistance, Junction to Ambient Air (Note 1)  
Operating and Storage Temperature Range  
305  
Tj, TSTG  
-65 to +150  
Notes:  
1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm2.  
2. Short duration test pulse used to minimize self-heating effect.  
Marking Information  
XX = Product Type Marking Code (See Page 2)  
YM = Date Code Marking  
Y = Year (ex: N = 2002)  
M = Month (ex: 9 = September)  
XX  
Date Code Key  
Year  
1998  
1999  
2000  
2001  
2002  
2003  
2004  
2005  
Code  
J
K
L
M
N
P
R
S
Month  
Code  
Jan  
Feb  
March  
Apr  
May  
Jun  
Jul  
Aug  
Sep  
Oct  
Nov  
Dec  
1
2
3
4
5
6
7
8
9
O
N
D
DS18004 Rev. 19 - 2  
1 of 3  
BZT52C2V4 - BZT52C39  

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