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BZT52C18 PDF预览

BZT52C18

更新时间: 2024-12-01 12:48:03
品牌 Logo 应用领域
永而佳 - WINNERJOIN 二极管测试
页数 文件大小 规格书
3页 238K
描述
Planar Die Construction

BZT52C18 数据手册

 浏览型号BZT52C18的Datasheet PDF文件第2页浏览型号BZT52C18的Datasheet PDF文件第3页 
RoHS  
BZT52C2V4-43  
SOD-123  
BZT52C2V4-BZT52C43 ZENER DIODE  
FEATURES:  
z
z
z
z
z
Planar Die Construction  
500mW Power Dissipation on Ceramic PCB  
General Purpose, Medium Current  
Ideally Suited for Automated Assembly Processes  
Available in Lead Free Version  
Maximum Ratings @Ta=25unless otherwise specified  
Characteristic  
Forward Voltage (Note 2) @ IF = 10mA  
Power Dissipation(Note 1)  
Symbol  
VF  
Value  
0.9  
Unit  
V
PD  
350  
mW  
/W  
Thermal Resistance, Junction to Ambient Air  
RθJA  
357  
Operating and Storage Temperature Range  
Tj,TSTG  
-65 to +150  
Notes: 1. Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25mm2.  
2. Short duration test pulse used to minimize self-heating effect.  
3. f = 1KHZ  
WEJ ELECTRONIC CO.,LTD  
WEJ ELECTRONIC CO.,LTD  
Http:// www.wej.cn  
E-mail:wej@yongerjia.com  

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