Philips Semiconductors
Product specification
Voltage regulator diodes
BZD27 series
REVERSE
CURRENT at
STAND-OFF
VOLTAGE
REVERSE
BREAKDOWN
VOLTAGE
TEST
CURREN
T
TEMPERATURE
COEFFICIENT
CLAMPING
VOLTAGE
TYPE
NUMBER
V(BR)R (V)
at Itest
at IRSM
(A)
note 1
SZ (%/K) at Itest
V(CL)R (V)
MAX.
IR (µA)
Itest
(mA)
at VR
(V)
MIN.
MIN.
MAX.
MAX.
168
188
208
228
251
280
310
340
370
400
440
480
0.09
0.09
0.09
0.09
0.09
0.09
0.09
0.09
0.09
0.09
0.09
0.09
0.13
0.13
0.13
0.13
0.13
0.13
0.13
0.13
0.13
0.13
0.13
0.13
5
5
2
2
2
2
2
2
2
2
2
2
249
276
305
336
380
419
459
498
537
603
655
707
0.60
0.54
0.50
0.45
0.40
0.36
0.33
0.30
0.28
0.25
0.23
0.21
5
5
5
5
5
5
5
5
5
5
5
5
150
160
180
200
220
240
270
300
330
360
390
430
BZD27-C180
BZD27-C200
BZD27-C220
BZD27-C240
BZD27-C270
BZD27-C300
BZD27-C330
BZD27-C360
BZD27-C390
BZD27-C430
BZD27-C470
BZD27-C510
Note
1. Non-repetitive peak reverse current in accordance with “IEC 60-1, Section 8” (10/1000 µs pulse); see Fig.8.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-tp
PARAMETER
CONDITIONS
VALUE
UNIT
thermal resistance from junction to tie-point
BZD27-C3V6 to -C6V8
55
30
K/W
K/W
BZD27-C7V5 to -C510
Rth j-a
thermal resistance from junction to ambient
BZD27-C3V6 to -C6V8
note 1
175
150
K/W
K/W
BZD27-C7V5 to -C510
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.7.
For more information please refer to the “General Part of associated Handbook”.
1996 Jun 10
6