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BXM80526B700128/SL4PY PDF预览

BXM80526B700128/SL4PY

更新时间: 2024-10-14 15:29:39
品牌 Logo 应用领域
英特尔 - INTEL 外围集成电路
页数 文件大小 规格书
2页 178K
描述
RISC Microprocessor, 32-Bit, 700MHz, CMOS, PPGA495

BXM80526B700128/SL4PY 技术参数

生命周期:Obsolete包装说明:SPGA, PGA495,21X24,50
Reach Compliance Code:compliant风险等级:5.84
位大小:32JESD-30 代码:R-PPGA-P495
端子数量:495封装主体材料:PLASTIC/EPOXY
封装代码:SPGA封装等效代码:PGA495,21X24,50
封装形状:RECTANGULAR封装形式:GRID ARRAY, SHRINK PITCH
电源:1.5,1.6 V认证状态:Not Qualified
速度:700 MHz子类别:Microprocessors
表面贴装:NO技术:CMOS
端子形式:PIN/PEG端子节距:1.27 mm
端子位置:PERPENDICULARuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC
Base Number Matches:1

BXM80526B700128/SL4PY 数据手册

 浏览型号BXM80526B700128/SL4PY的Datasheet PDF文件第2页 
product brief  
Intel® Celeron® Processor - Low  
Power for Applied Computing  
Product Highlights  
I
300 MHz and 400 MHz:  
-
Built on the Intel 0.18 micron process  
-
128K Full speed on-die L2 cache operating  
at core frequency  
-
Low profile, surface mount BGA package  
-
BGA (31 x 27 x 2.5mm), (BGA2)  
-
495 leads in area array  
-
Tcase: 0 to 100C  
I
650 MHz:  
Ultra-Low Voltage 650 MHz  
-
Built on the Intel 0.13 micron process  
I
650 MHz processor speed  
-
256K Full speed on-die L2 cache operating at  
core frequency  
I
100 MHz processor side bus  
-
Low profile, surface mount µFCBGA package  
I
8.3W TDP (max), 7.0W TDP (typ)  
-
µFCBGA package (35 x 35 mm)  
I
Supported with Intel 440MX and Intel 815E  
chipsets  
-
479 balls in area array  
-
Tcase: 0 to 100C  
Product Overview  
I
Functional features  
-
MMX technology  
The Intel® Celeron® processors - Low Power,  
Ultra Low Power and Ultra Low Voltage now  
-
Floating Point Unit (FPU)  
-
Dynamic Execution Micro-Architecture  
provide an exceptional value for thermally  
sensitive and space constrained applied  
computing applications by combining the  
optimal balance of cost, performance, and low  
power. Available in the small form factor BGA  
package at 300 and 400 MHz with 128K of  
on-die L2 cache or the µFCBGA package at  
650 MHz with 256K of on-die L2 cache. These  
features make it ideal for value-based, low-  
profile, low-power applied computing  
applications, such as data communications,  
telecommunications, industrial automation and  
transaction terminals.  
The 300 MHz processor, at just 1.1V and 5.7  
W TDP (max), and the 650 MHz processor,  
also at 1.1V and with a 8.3W TDP (max), are  
ideal solutions for communication appliances  
such as set-top boxes, network attached  
storage, web pads and other applications with  
lower power envelopes and BOM  
-
On-Die L2 Cache with Error Checking and  
Correcting (ECC)  
Low Power 400 MHz  
I
400 MHz processor speed  
I
100 MHz processor side bus  
I
10.1W TDP (max). 6.5 W TDP (typ)  
®
®
I
Supported with the Intel 815, Intel 815E,  
Intel® 440BX AGPset and Intel® 440MX  
Chipsets  
Ultra-Low Power 300 MHz  
I
300 MHz processor speed  
I
100 MHz processor side bus  
I
5.7W TDP (max), 4.2 W TDP (typ)  
I
Supported with the Intel 815, Intel 815E, and the  
Intel 440MX Chipsets  
requirements.  

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