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BUL44AF

更新时间： 2024-09-26 17:46:27
品牌 Logo 应用领域
安森美 - ONSEMI 局域网开关晶体管
页数 文件大小 规格书
8页 180K
描述
2A, 400V, NPN, Si, POWER TRANSISTOR, PLASTIC, TO-220AB, 3 PIN

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中文翻译

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BUL44AF 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
零件包装代码：TO-220AB包装说明：FLANGE MOUNT, R-PSFM-T3
针数：3Reach Compliance Code：compliant
ECCN代码：EAR99风险等级：5.8
外壳连接：COLLECTOR最大集电极电流 (IC)：2 A
集电极-发射极最大电压：400 V配置：SINGLE
最小直流电流增益 (hFE)：8JESD-30 代码：R-PSFM-T3
JESD-609代码：e0元件数量：1
端子数量：3封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：FLANGE MOUNT
峰值回流温度（摄氏度）：NOT SPECIFIED极性/信道类型：NPN
认证状态：Not Qualified表面贴装：NO
端子面层：TIN LEAD端子形式：THROUGH-HOLE
端子位置：SINGLE处于峰值回流温度下的最长时间：NOT SPECIFIED
晶体管应用：SWITCHING晶体管元件材料：SILICON
标称过渡频率 (fT)：13 MHzBase Number Matches：1

BUL44AF 数据手册

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BUL44G  
SWITCHMODEt NPN  
Bipolar Power Transistor  
For Switching Power Supply Applications  
The BUL44G have an applications specific state−of−the−art die  
designed for use in 220 V line operated Switchmode Power supplies  
and electronic light ballasts.  
http://onsemi.com  
POWER TRANSISTOR  
2.0 AMPERES, 700 VOLTS,  
40 AND 100 WATTS  
Features  
• Improved Efficiency Due to Low Base Drive Requirements:  
High and Flat DC Current Gain h  
Fast Switching  
FE  
No Coil Required in Base Circuit for Turn−Off (No Current Tail)  
• Full Characterization at 125°C  
• Tight Parametric Distributions are Consistent Lot−to−Lot  
• These Devices are Pb−Free and are RoHS Compliant*  
TO−220AB  
CASE 221A−09  
STYLE 1  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
1
2
3
Collector−Emitter Sustaining Voltage  
V
CEO  
400  
Vdc  
Collector−Base Breakdown Voltage  
Emitter−Base Voltage  
V
700  
9.0  
Vdc  
Vdc  
Adc  
CES  
EBO  
V
MARKING DIAGRAM  
Collector Current − Continuous  
− Peak (Note 1)  
I
C
2.0  
5.0  
I
I
CM  
Base Current  
− Continuous  
− Peak (Note 1)  
I
B
1.0  
2.0  
Adc  
BM  
BUL44G  
AY WW  
Total Device Dissipation @ T = 25_C  
P
50  
0.4  
W
W/_C  
C
D
Derate above 25°C  
Operating and Storage Temperature  
THERMAL CHARACTERISTICS  
T , T  
−65 to 150  
_C  
J
stg  
BUL44 = Device Code  
Characteristics  
Symbol  
Max  
Unit  
_C/W  
_C/W  
_C  
A
Y
= Assembly Location  
= Year  
Thermal Resistance, Junction−to−Case  
R
q
JC  
2.5  
WW  
G
= Work Week  
= Pb−Free Package  
Thermal Resistance, Junction−to−Ambient  
R
q
JA  
62.5  
260  
Maximum Lead Temperature for Soldering  
Purposes 1/8″ from Case for 5 Seconds  
T
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Pulse Test: Pulse Width = 5 ms, Duty Cycle ≤ 10%.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
50 Units / Rail  
BUL44G  
TO−220  
(Pb−Free)  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
April, 2010 − Rev. 7  
BUL44/D  
 
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