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BUDI-5000-1A

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BUDI-5000-1A 数据手册

DIOTEC ELECTRONICS CORP

Data Sheet No. BUDI-5000-1A

50 AMP BUTTON DIODES

Mechanical Specification

FEATURES

Features

Void Free Vacuum Die Soldering For Maximum

Mechanical Strength and Heat Dissipation

Die Size:

0.180" x 0.180"

Square

(Solder Voids: Typical < 2%, Max. < 10% of Die Area)

Biggest Effective Die Area for the 50 Amp Class of

Button Diodes

High Temperature Solder (Solidus 287 C, Liquidus 296 C)

to Allow Higher Operating And Assembly Temperatures

Copper Headers Are Silver Plated For Easy Soldering

And Superior Solder Joints

Mechanical Data

Case: Molded Epoxy (UL Flammability Rating 94V-O)

Finish: All Metal Surfaces Are Silver Plated

Soldering Temperature: 250 C maximum

Mounting Position: Any

Polarity: Color band denotes cathode

Weight: 0.6 Ounces (1.8 Grams)

Maximum Ratings & Electrical Characteristics

K11

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