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BUDI-7500D-1A

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BUDI-7500D-1A 数据手册

DIOTEC ELECTRONICS CORP

Data Sheet No. BUDI-7500D-1A

75 AMP JUMBO DIODE CELL

MECHANICAL SPECIFICATION

FEATURES

Void Free Vacuum Die Soldering For

Maximum Mechanical Strength and Heat

Dissipation (Solder Voids:

Die Size:

0.250" Diameter

Round die

Typical < 2%, Max. < 10% of Die Area)

Biggest Effective Die Area for the 75 Amp

Class of Jumbo Diode Cells

High Temperature Solder (Solidus 287 C,

Liquidus 296 C) to Allow Higher Operating

And Assembly Temperatures

Copper Headers Are Silver Plated For

Easy Soldering And Superior Solder Joints

Largest Diameter Header Is Cathode

RoHS COMPLIANT

MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS

K27

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