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BU7252G-TR PDF预览

BU7252G-TR

更新时间： 2024-01-20 18:29:10
品牌 Logo 应用领域
罗姆 - ROHM 比较器
页数 文件大小 规格书
17页 455K
描述
Low Voltage CMOS Comparator

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中文翻译

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BU7252G-TR 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：MSOP
包装说明：VSSOP, TSSOP8,.16针数：8
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01Factory Lead Time：9 weeks
风险等级：5.25Is Samacsys：N
放大器类型：COMPARATOR最大输入失调电压：11000 µV
JESD-30 代码：R-PDSO-G8长度：2.9 mm
负供电电压上限：标称负供电电压 (Vsup)：
功能数量：2端子数量：8
最高工作温度：105 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：VSSOP
封装等效代码：TSSOP8,.16封装形状：RECTANGULAR
封装形式：SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH峰值回流温度（摄氏度）：NOT SPECIFIED
电源：3 V认证状态：Not Qualified
标称响应时间：50 ns座面最大高度：0.9 mm
子类别：Comparator最大压摆率：0.08 mA
供电电压上限：7 V标称供电电压 (Vsup)：3 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子形式：GULL WING
端子节距：0.65 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：2.8 mm
Base Number Matches：1

BU7252G-TR 数据手册

 浏览型号BU7252G-TR的Datasheet PDF文件第11页浏览型号BU7252G-TR的Datasheet PDF文件第12页浏览型号BU7252G-TR的Datasheet PDF文件第13页浏览型号BU7252G-TR的Datasheet PDF文件第15页浏览型号BU7252G-TR的Datasheet PDF文件第16页浏览型号BU7252G-TR的Datasheet PDF文件第17页 
● Derating curve  
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature).IC is heated  
when it consumed power, and the temperature of IC ship becomes higher than ambient temperature. The temperature that  
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power  
dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of  
package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the  
storage package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in  
the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the  
package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called thermal  
resistance, represented by the symbol θj-a[℃/W]. The temperature of IC inside the package can be estimated by this thermal  
resistance. Fig.6 (a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient temperature Ta,  
junction temperature Tj, and power dissipation Pd can be calculated by the equation below :  
θja ＝ (Tj－Ta) / Pd  
[℃/W]  
・・・・・ （Ⅰ）  
Derating curve in Fig.6 (b) indicates power that can be consumed by IC with reference to ambient temperature. Power that  
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal  
resistance θja. Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package  
condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value  
measured at a specified condition. Fig7(c)-(f) show a derating curve for an example of BU7251family, BU7252 family, BU7231  
family, BU7232 family.  
Power dissipation Pd:[W]  
Pd(max)  
θja = ( Tj Ta ) / Pd  
[
℃
/W]  
ー
P2  
θja2 < θja1  
Ambient temperature Ta [  
]
℃
θja2  
P1  
Tj(max)  
θja1  
50  
Chip surface temperature Tj [  
]
℃
0
25  
75  
100  
125  
150  
Power dissipation P [W]  
Ambient temperature:Ta[  
]
℃
BU7251/BU7231  
Tj(max)  
(b) Derating curve  
(a) Thermal resistance  
Fig6. Thermal resistance and power dissipation  
800  
600  
400  
200  
0
1000  
800  
BU7252F(*9)  
BU7232F(*9)  
620[mw]  
480[mw]  
BU7251G(*8)  
540[mw]  
600  
400  
200  
0
BU7231G(*8)  
BU7252FVM(*10)  
BU7232FVM(*10)  
85  
0
50  
100  
150  
0
50  
100  
150  
85  
AMBIENT TEMPERATURE [  
]
℃
AMBIENT TEMPERATURE [  
]
℃
(d) BU7252F/FVM BU7232F/FVM  
(c) BU7251G BU7231G  
1000  
800  
600  
400  
200  
0
800  
600  
400  
200  
0
BU7252SF(*9)  
BU7232SF(*9)  
620[mw]  
480[mw]  
BU7251SG(*8)  
BU7231SG(*8)  
540[mw]  
BU7252SFVM(*10)  
BU7232SFVM(*10)  
105  
100  
105  
0
50  
150  
0
50  
100  
150  
AMBIENT TEMPERATURE [  
]
℃
AMBIENT TEMPERATURE [  
]
℃
(e) BU7251SG BU7231SG  
(f) BU7252S F/FVM BU72432S F/FVM  
（*8） （*9） （*10）  
Unit  
[mW/℃]  
5.4  
6.2  
4.8  
When using the unit above Ta=25[℃], subtract the value above per degree[℃]. Permissible dissipation is the value  
when FR4 glass epoxy board 70[mm]×70[mm]×1.6[mm] (cooper foil area below 3[％]) is mounted.  
Fig7. Derating curve  
14/16  
1...11121314151617

中文翻译

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