是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | VFBGA, BGA120,11X11,25 | 针数: | 120 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.64 | 商用集成电路类型: | CONSUMER CIRCUIT |
JESD-30 代码: | S-PBGA-B120 | JESD-609代码: | e1 |
长度: | 8 mm | 功能数量: | 1 |
端子数量: | 120 | 最高工作温度: | 85 °C |
最低工作温度: | -30 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装等效代码: | BGA120,11X11,25 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 1.5,1.8,2.5 V |
认证状态: | Not Qualified | 座面最大高度: | 0.9 mm |
子类别: | Other Consumer ICs | 最大供电电压 (Vsup): | 1.55 V |
最小供电电压 (Vsup): | 1.45 V | 表面贴装: | YES |
温度等级: | OTHER | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.65 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 10 |
宽度: | 8 mm | Base Number Matches: | 1 |
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