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BTS5242-2L PDF预览

BTS5242-2L

更新时间: 2024-02-06 18:34:58
品牌 Logo 应用领域
英飞凌 - INFINEON 开关电源开关
页数 文件大小 规格书
24页 489K
描述
Smart High-Side Power Switch

BTS5242-2L 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:SSOP, SOP12,.4,40针数:12
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:8.04
内置保护:TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE驱动器位数:2
接口集成电路类型:HALF BRIDGE BASED PERIPHERAL DRIVERJESD-30 代码:R-PDSO-G12
长度:7.5 mm湿度敏感等级:3
功能数量:1端子数量:12
输出电流流向:SINK标称输出峰值电流:4.5 A
封装主体材料:PLASTIC/EPOXY封装代码:SSOP
封装等效代码:SOP12,.4,40封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, SHRINK PITCH峰值回流温度(摄氏度):NOT SPECIFIED
电源:9/16 V认证状态:Not Qualified
座面最大高度:2.6 mm子类别:Peripheral Drivers
最大供电电压:28 V最小供电电压:4.5 V
标称供电电压:13.5 V表面贴装:YES
技术:MOS端子形式:GULL WING
端子节距:1 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED断开时间:250 µs
接通时间:250 µs宽度:6.4 mm
Base Number Matches:1

BTS5242-2L 数据手册

 浏览型号BTS5242-2L的Datasheet PDF文件第6页浏览型号BTS5242-2L的Datasheet PDF文件第7页浏览型号BTS5242-2L的Datasheet PDF文件第8页浏览型号BTS5242-2L的Datasheet PDF文件第10页浏览型号BTS5242-2L的Datasheet PDF文件第11页浏览型号BTS5242-2L的Datasheet PDF文件第12页 
Smart High-Side Power Switch  
BTS5242-2L  
Electrical Characteristics  
Tj = 25 °C (unless otherwise specified)  
Pos. Parameter  
Symbol Limit Values Unit Test Conditions  
min. max.  
ESD Susceptibility  
4.1.17 ESD susceptibility HBM  
VESD  
kV according to  
EIA/JESD 22-A  
114B  
IN, CLA  
IS  
-1  
-2  
-4  
1
2
4
OUT  
1) R and L describe the complete circuit impedance including line, contact and generator impedances  
2) Load Dump is specified in ISO 7637, RI is the internal resistance of the Load Dump pulse generator  
3) Current limitation is a protection feature. Operation in current limitation is considered as “outside” normal operating range.  
Protection features are not designed for continuous repetitive operation.  
4) Pulse shape represents inductive switch off: IL(t) = IL(0) * (1 - t / tpeak); 0 < t < tpeak. Please see Figure 8  
5) Device mounted on PCB (50 mm x 50 mm x 1.5 mm epoxy, FR4) with 6 cm2 copper heatsinking area (one layer, 70 µm  
thick) for Vbb connection. PCB is vertical without blown air.  
Note:Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute  
maximum rating conditions for extended periods may affect device reliability.  
Note:Integrated protection functions are designed to prevent IC destruction under fault conditions described in the  
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are  
not designed for continuous repetitive operation.  
Data Sheet  
9
Rev.1.2, 2008-09-01  

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