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BSM181

更新时间: 2024-11-08 22:48:31
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体电源电路开关晶体管功率场效应晶体管
页数 文件大小 规格书
7页 203K
描述
SIMOPAC Module (Power module Single switch N channel Enhancement mode)

BSM181 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:compliant风险等级:5.69
Is Samacsys:N最大漏极电流 (Abs) (ID):36 A
FET 技术:METAL-OXIDE SEMICONDUCTOR元件数量:1
最高工作温度:150 °C最大功率耗散 (Abs):700 W
子类别:FET General Purpose PowerBase Number Matches:1

BSM181 数据手册

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SIMOPAC® Module  
BSM 181  
BSM 181 R  
VDS  
I D  
= 100 V  
= 200 A  
R DS(on) = 8.5 mΩ  
Power module  
Single switch  
N channel  
Enhancement mode  
Package with insulated metal base plate  
Package outline/Circuit diagram: 11)  
Type  
Ordering Code  
BSM 181  
BSM 181 R  
C67076-A1001-A2  
C67076-A1016-A2  
Maximum Ratings  
Parameter  
Symbol  
VDS  
Values  
800  
Unit  
Drain-source voltage  
V
Drain-gate voltage, RGS = 20 kΩ  
Gate-source voltage  
VDGR  
VGS  
800  
± 20  
Continuous drain current, TC = 25 ˚C  
Pulsed drain current, TC = 25 ˚C  
Operating and storage temperature range  
Power dissipation, TC = 25 ˚C  
ID  
36  
A
ID puls  
Tj, Tstg  
Ptot  
144  
– 55 … + 150  
700  
˚C  
W
Thermal resistance  
Chip-case  
K/W  
Rth JC  
Vis  
0.18  
2500  
16  
Insulation test voltage2), t = 1 min.  
Creepage distance, drain-source  
Clearance, drain-source  
Vac  
mm  
11  
DIN humidity category, DIN 40 040  
IEC climatic category, DIN IEC 68-1  
F
55/150/56  
1)  
See chapter Package Outline and Circuit Diagrams.  
Insulation test voltage between drain and base plate referred to standard climate 23/50 in acc. with  
DIN 50 014, IEC 146, para. 492.1.  
2)  
Semiconductor Group  
57  
03.96  

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