Datasheet > BSF450NE7NH3

BSF450NE7NH3

更新时间： 2024-11-06 01:18:03

品牌	Logo	应用领域
英飞凌 - INFINEON		/
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1页	32K
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Material Content Data Sheet

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BSF450NE7NH3 数据手册

Material Content Data Sheet

Sales Product Name BSF450NE7NH3

Issued

4. September 2015

MA#

MA001389732

Package

MG-WDSON-2-1

Weight*

49.87 mg

Average

Mass

[%]

Average

CAS#

Weight

[mg]

Sum

[%]

Sum

Construction Element

Material Group

Substances

Mass

[ppm]

if applicable

[ppm]

chip

inorganic material

non noble metal

noble metal

silicon

copper

nickel

7440-21-3

7440-50-8

7440-02-0

7440-22-4

7440-02-0

1.774

45.429

0.121

0.482

0.121

0.107

0.656

0.005

0.032

1.028

0.110

3.56

91.11

0.24

0.97

0.24

0.21

1.32

0.01

0.06

2.06

0.22

3.56

35580

911044

2429

9663

2429

2142

13160

107

35580

leadframe

leadfinish

91.11

911044

silver

1.21

0.24

12092

2429

plating

glue

non noble metal

plastics

nickel

epoxy resin

silver

noble metal

7440-22-4

7440-50-8

7440-22-4

7440-31-5

1.53

15302

solder

non noble metal

noble metal

copper

silver

641

non noble metal

plastics

tin

2.13

0.22

20606

2199

21354

2199

passivation

*deviation

epoxy resin

< 10%

Sum in total: 100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.

Company

Address

Internet

Infineon Technologies AG

81726 München

www.infineon.com

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