是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Contact Manufacturer | 包装说明: | SOP, SOP8,.25 |
Reach Compliance Code: | compliant | 风险等级: | 5.5 |
数据保留时间-最小值: | 40 | 耐久性: | 1000000 Write/Erase Cycles |
JESD-30 代码: | R-PDSO-G8 | JESD-609代码: | e3 |
内存密度: | 2048 bit | 内存集成电路类型: | EEPROM CARD |
内存宽度: | 16 | 湿度敏感等级: | 1 |
端子数量: | 8 | 字数: | 128 words |
字数代码: | 128 | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | 组织: | 128X16 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOP |
封装等效代码: | SOP8,.25 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 并行/串行: | SERIAL |
峰值回流温度(摄氏度): | 225 | 电源: | 3/5 V |
编程电压: | 2.7 V | 认证状态: | Not Qualified |
串行总线类型: | MICROWIRE | 最大待机电流: | 0.00001 A |
子类别: | EEPROMs | 最大压摆率: | 0.0045 mA |
表面贴装: | YES | 技术: | CMOS |
温度等级: | AUTOMOTIVE | 端子面层: | MATTE TIN |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
写保护: | SOFTWARE | Base Number Matches: | 1 |
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EEPROM, 256X16, Serial, CMOS, PDSO8, LEAD FREE, SOP-8 | |
BR93H66FJ-WE2 | ROHM |
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