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BQ25306RTER PDF预览

BQ25306RTER

更新时间: 2024-10-29 11:11:43
品牌 Logo 应用领域
德州仪器 - TI 电池
页数 文件大小 规格书
38页 2558K
描述
独立型 17V、3A 1 至 2 节降压电池充电器 | RTE | 16 | -40 to 85

BQ25306RTER 数据手册

 浏览型号BQ25306RTER的Datasheet PDF文件第3页浏览型号BQ25306RTER的Datasheet PDF文件第4页浏览型号BQ25306RTER的Datasheet PDF文件第5页浏览型号BQ25306RTER的Datasheet PDF文件第7页浏览型号BQ25306RTER的Datasheet PDF文件第8页浏览型号BQ25306RTER的Datasheet PDF文件第9页 
BQ25306  
www.ti.com.cn  
ZHCSMH4A MARCH 2020 REVISED NOVEMBER 2020  
7-1. Pin Functions (continued)  
PIN  
I/O(1)  
DESCRIPTION  
NAME  
NO.  
Battery voltage feedback input. Connect this pin to resistor dividers middle point to program battery  
charge voltage. When this pin is shorted to GND or open by fault, the converter stop switching and STAT  
pin blinks. The resistor divider consists of a resistor R1 from battery positive terminal to FB pin and a  
resistor R2 from FB pin to FB_GND. The recommended resistance value of R2 is 200kΩor lower. The  
battery charge voltage is programmed as VBATREG = 1.1 (1 + R1/R2). The voltage regulation loop is  
internally compensated and a 470pF feedforward capacitor is recommended to connect from battery to FB  
pin.  
FB  
9
AI  
Battery voltage feedback ground input. Connect the feedback resistor divider's low side resister to this pin.  
The input of this pin is in high impedance when adaptor is unplugged or the charger is disabled by EN pin.  
FB_GND  
POL  
8
5
AI  
AI  
EN pin polority selection. Keep this pin floating for standalone charger.  
Device sisable input. With POL pin floating, the device is enabled with EN pin floating or pulled low, and  
the device is disabled if EN pin is pulled high. With POL pin grounded, the device is enabled with EN pin  
pulled high, and the device is disabled with EN pin pulled low or floating.  
EN  
6
AI  
Ground reference for the device that is also the thermal pad used to conduct heat from the device. This  
connection serves two purposes. The first purpose is to provide an electrical ground connection for the  
device. The second purpose is to provide a low thermal-impedance path from the device die to the PCB.  
This pad should be tied externally to a ground plane. Ground layer(s) are connected to thermal pad  
through vias under thermal pad.  
Thermal Pad  
17  
-
(1) AI = Analog input, AO = Analog Output, AIO = Analog input Output, DI = Digital input, DO = Digital Output, DIO = Digital input Output,  
P = Power  
Copyright © 2023 Texas Instruments Incorporated  
English Data Sheet: SLUSDC7  
6
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Product Folder Links: BQ25306  
 

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